Semiconductor device and including an optical waveguide and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11262500-B2
Application number	US-201916700580-A
Country	US
Kind code	B2
Filing date	Dec 2, 2019
Priority date	Dec 2, 2019
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A semiconductor device includes a semiconductor substrate having a first surface, a second surface opposite to the first surface, and having a first recess portion formed on the first surface, a first cladding layer located in the first recess portion, and a first optical waveguide formed on the first cladding layer. The first optical waveguide overlaps with the first cladding layer in plan view.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor substrate having a first surface and a second surface opposite the first surface, wherein the semiconductor substrate includes a first recess portion formed on the first surface;
a first cladding layer located in the first recess portion;
a first optical waveguide formed on the first cladding layer, wherein the first optical waveguide overlaps the first cladding layer in plan view;
a first insulating layer formed on the first surface of the semiconductor substrate and an inner surface of the first recess portion;
a second insulating layer formed on the first insulating layer and the first cladding, wherein the first optical waveguide is formed on a portion of the second insulating layer, and wherein the portion of the second insulating layer overlaps the first cladding layer in plan view;
a first resistive element formed on the second insulating layer; and
a second resistive element formed on the second insulating layer,
wherein the semiconductor substrate includes a second recess portion formed on the first surface of the semiconductor substrate, and
wherein the second recess portion overlaps the first resistive element without overlapping the second resistive element in plan view.

2. The semiconductor device according to claim 1 , wherein the first cladding is an insulating film.

3. The semiconductor device according to claim 2 , comprising:
a second cladding layer located in a third recess portion formed on the first surface of the semiconductor substrate; and
an optical receiver formed on the second cladding layer,
wherein a thickness of the second cladding layer is less than a thickness of the first cladding layer.

4. The semiconductor device according to claim 1 ,
wherein the first cladding layer is a gas contained in the first recess portion.

5. The semiconductor device according to claim 1 , wherein an upper surface of the first insulating layer and a lower surface of the second insulating layer are directly contacted with each other.

6. The semiconductor device according to claim 1 , comprising a second optical waveguide formed on the first cladding.

7. The semiconductor device according to claim 1 , comprising a third cladding located in a third recess portion formed on the first surface of the semiconductor substrate,
wherein the first cladding layer overlaps a portion of the first optical waveguide in plan view, and
wherein the third cladding overlaps with another portion of the first optical waveguide in plan view.

Assignees

• Renesas Electronics Corp

Inventors

• Iida Tetsuya
• Nakashiba Yasutaka
• Namioka Seigo
• Nakayama Tomoo

Classifications

• G02F1/025 Primary

  in an optical waveguide structure (G02F1/017, {G02F1/2257} take precedence) · CPC title

• G02B6/13

  Integrated optical circuits characterised by the manufacturing method · CPC title

• G02B6/122 Primary

  Basic optical elements, e.g. light-guiding paths · CPC title

• G02B2006/12142

  Modulator · CPC title