Systems and methods for workpiece processing

US11257696B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11257696-B2
Application numberUS-202016782110-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2020
Priority dateOct 18, 2016
Publication dateFeb 22, 2022
Grant dateFeb 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

First claim

Opening claim text (preview).

What is claimed is: 1. A processing system for processing a plurality of workpieces, the processing system comprising: a first process chamber having two processing stations; a second process chamber having two processing stations; a transfer chamber in process flow communication with the first process chamber and the second process chamber, the first process chamber disposed on a first side of the transfer chamber, the second process chamber disposed on a second side of the transfer chamber, the second side of the transfer chamber being opposite the first side of the transfer chamber; a first workpiece position disposed on a third side of the transfer chamber; a second workpiece position disposed on a fourth side of the transfer chamber, the fourth side of the transfer chamber being opposite the third side of the transfer chamber, wherein the second workpiece position comprises a transfer position including a workpiece column configured to support a plurality of workpieces in a stacked arrangement; and a rotary robot disposed in the transfer chamber, the rotary robot comprising a first robot arm and a second robot arm, the first robot arm and the second robot arm each having a pair of workpiece blades, wherein the rotary robot is configured to simultaneously extend both the first robot arm and the second robot arm to the workpiece column such that the first robot arm grabs a first workpiece in the workpiece column and the second robot arm grabs a second workpiece in the workpiece column, wherein the rotary robot is further configured to simultaneously transfer the first workpiece and the second workpiece to the two processing stations in the first process chamber, wherein the two processing stations in the first process chamber are disposed in a side-by-side arrangement, wherein after grabbing the first workpiece and prior to transferring the first workpiece and the second workpiece to the two side-by-side processing stations in the first process chamber, the rotary robot is configured to grab a workpiece already located on one of the two side-by-side processing stations in the first process chamber with one of the pair of workpiece blades located on the first robot arm. 2. The processing system of claim 1 , wherein the first workpiece position comprises a loadlock chamber. 3. The processing system of claim 1 , wherein the first workpiece position comprises at least one workpiece column. 4. The processing system of claim 1 , wherein the first process chamber, the second process chamber, the transfer chamber, the first workpiece position and the second workpiece position are configured to be operated at a common pressure. 5. The processing system of claim 1 , wherein the first process chamber, the second process chamber, the transfer chamber, the first workpiece position and the second workpiece position are in process flow communication without vacuum break. 6. The processing system of claim 1 , further comprising a second transfer chamber in process flow communication with the second workpiece position. 7. The processing system of claim 6 , further comprising: a third process chamber having two processing stations; a fourth process chamber having two processing stations; the third process chamber disposed on a first side of the second transfer chamber; the fourth process chamber disposed on a second side of the second transfer chamber; the second side of the transfer chamber being opposite the first side of the transfer chamber. 8. The processing system of claim 7 , wherein the third process chamber is disposed in a linear relationship with the first process chamber. 9. The processing system of claim 8 , wherein the fourth processing chamber is disposed in a linear relationship with the second process chamber. 10. The processing system of claim 8 , wherein the second workpiece position is disposed on a third side of the second transfer chamber. 11. The processing system of claim 10 , further comprising a third workpiece position coupled to a fourth side of the second transfer chamber, the fourth side of the second transfer chamber being opposite to the third side of the second transfer chamber. 12. The processing system of claim 8 , wherein the first process chamber, the second process chamber, the transfer chamber, the first workpiece position, the second workpiece position, the second transfer chamber, the third process chamber, and the fourth process chamber are configured to be operated at a common pressure. 13. The processing system of claim 8 , wherein the first process chamber, the second process chamber, the transfer chamber, the first workpiece position, the second workpiece position, the second transfer chamber, the third process chamber, and the fourth process chamber are in process flow communication without vacuum break. 14. The processing system of claim 8 , wherein the second transfer chamber comprises a rotary robot. 15. The processing system of claim 1 , wherein a front end portion is in process flow communication with the first workpiece position. 16. The processing system of claim 15 , wherein the first workpiece position is configured to be operated at a different pressure than the front end portion. 17. A processing system for processing a plurality of workpieces, the processing system comprising: a first process chamber having at least two processing stations; a second process chamber having at least one processing station; a third process chamber having at least two processing stations; a workpiece column disposed in a transfer chamber configured to support a plurality of workpieces in a stacked arrangement; a transfer chamber in process flow communication with the first process chamber, the second process chamber, the third process chamber, and the workpiece column, wherein the transfer chamber has a straight side; and a rotary robot disposed in the transfer chamber, the rotary robot comprising a first robot arm and a second robot arm, the first robot arm and the second robot arm each having a pair of workpiece blades, wherein the rotary robot is configured to simultaneously extend both the first robot arm and the second robot arm to the workpiece column such that the first robot arm grabs a first workpiece in the workpiece column and the second robot arm grabs a second workpiece in the workpiece column, wherein the rotary robot is further configured to simultaneously transfer the first workpiece and the second workpiece to the two processing stations in the first process chamber, wherein the two processing stations in the first process chamber are disposed in a side-by-side arrangement, wherein after grabbing the first workpiece and prior to transferring the first workpiece and the second workpiece to the two side-by-side processing stations in the first process chamber, the rotary robot is configured to grab a workpiece already located on one of the two side-by-side processing stations in the first process chamber with one of the pair of workpiece blades located on the first robot arm, and wherein the first process chamber and the third process chamber are connected to the transfer chamber on the straight side. 18. A processing system for processing a plurality of workpieces, the processing system comprising: a first process chamber having two processing stations; a second process chamber having at least one processing station; a transfer chamber in process flow communication with the first process chamber and the second process chamber, the first process chamber disposed on a first side of the transfer chamber, t

Assignees

Inventors

Classifications

  • Mechanical parts of transfer devices · CPC title

  • characterised by the construction of the load-lock chamber · CPC title

  • surrounding a central transfer chamber · CPC title

  • characterised by the construction of the transfer chamber · CPC title

  • Electricity · mapped topic

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What does patent US11257696B2 cover?
Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can f…
Who is the assignee on this patent?
Mattson Tech Inc, Beijing E Town Semiconductor Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0454. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).