Methods and apparatus for cleaning semiconductor wafers

Patent metadata

Field	Value
Publication number	US-11257667-B2
Application number	US-201616092193-A
Country	US
Kind code	B2
Filing date	Apr 6, 2016
Priority date	Apr 6, 2016
Publication date	Feb 22, 2022
Grant date	Feb 22, 2022

Abstract

A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f 1 and power P 1 ; and at zero output before bubble cavitation occurs; followed by at f 1 and P 1 again after bubble temperature is lowered; detecting power on time (at P 1 , f 1 ), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T 1 , power off time with a preset time τ 2 , amplitude of each waveform with a preset value, if the detected power on time is longer than τ 1 , or power off time is shorter than τ 2 , or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.

First claim

What is claimed is:

1. An apparatus for cleaning a semiconductor wafer comprising features of patterned structures, the apparatus comprising:
a wafer holder configured to hold the semiconductor wafer;
an inlet configured to apply liquid on the semiconductor wafer;
a transducer configured to deliver acoustic energy to the liquid;
a power supply of the transducer;
a controller for the power supply comprising a timer, the controller being configured to control the transducer based on the timer to:
deliver acoustic energy to the liquid at a first frequency and a first power level for a predetermined first time period, as determined by the timer, and
deliver no acoustic energy to the liquid for a predetermined second time period, as determined by the timer,
wherein the controller is configured to alternately apply the first and second time periods one after another for a predetermined number of cycles comprising a plurality of power on times of the power supply; and

a detection system configured to:
detect each power on time of the power supply, and
shut down the power supply when at least one power on time exceeds a first preset value.

2. The apparatus of claim 1 , wherein the detection system is further configured to transmit an alarm signal when the at least one power on time exceeds the first preset value.

3. The apparatus of claim 1 , wherein the predetermined number of cycles further comprises a plurality of power off times of the power supply, and wherein the detection system is further configured to:
detect each power off time of the power supply; and
shut down the power supply when at least one power off time is less than a second preset value.

4. The apparatus of claim 3 , wherein the detection system is further configured to transmit an alarm signal when the at least one power off time is less than the second preset value.

5. The apparatus of claim 1 , wherein the detection system comprises:
a voltage attenuation circuit configured to attenuate an amplitude of a waveform output by the power supply;
a shaping circuit configured to convert the attenuated waveform into a square wave;
a pulse conversion circuit configured to convert a power on portion of the square wave into a first signal output; and
a periodic measuring circuit configured to measure a period of time associated with the first signal output.

6. The apparatus of claim 5 , wherein an attenuation ratio of the voltage attenuation circuit is between 5 and 100.

7. The apparatus of claim 5 , wherein the detection system is configured to determine that the least one power on time as a value smaller than the measured period of time associated with of the first signal output.

8. The apparatus of claim 7 , wherein the at least one power on time is determined as τ−τ 3 , wherein τ is the measured length of period of time associated with the high level first signal output, and wherein τ 3 is a period of time during which the power supply oscillating a plurality of periods oscillates after the power supply is shut down.

9. The apparatus of claim 5 , wherein the detection system further comprises a power circuit configured to power the pulse conversion circuit.

10. The apparatus of claim 9 , wherein the power circuit is configured to convert a DC 15V to a target voltage.

11. The apparatus of claim 1 , wherein the detection system further comprises a communication circuit configured to transmit a shut down signal to the controller.

12. The apparatus of claim 11 , wherein the communication circuit implements a RS232 or a RS485 serial communication.

13. The apparatus of claim 1 , wherein the transducer is further coupled with the inlet and positioned adjacent to the semiconductor wafer, the acoustic energy of the transducer is transmitted to the semiconductor wafer through the liquid column out of the inlet.

14. An apparatus for cleaning a semiconductor wafer comprising features of patterned structures, the apparatus comprising:
a wafer holder configured to hold the semiconductor wafer;
an inlet configured to apply liquid on the semiconductor wafer;
a transducer configured to deliver acoustic energy to the liquid;
a power supply of the transducer;
a controller for the power supply comprising a timer, the controller being configured to control the transducer based on the timer to:
deliver acoustic energy to the liquid at a first frequency and a first power level for a predetermined first time period, as determined by the timer, and
deliver no acoustic energy to the liquid for a predetermined second time period, as determined by the timer,
wherein the controller is configured to alternately apply the first and second time periods one after another for a predetermined number of cycles comprising a plurality of power off times of the power supply; and

a detection system configured to:
detect each power off time of the power supply, and
shut down the power supply when at least one power off time is less than a preset value.

15. The apparatus of claim 14 , wherein the detection system is further configured to transmit an alarm signal when the at least one power off time is less than the preset value.

16. An apparatus for cleaning a semiconductor wafer comprising features of patterned structures, the apparatus comprising:
a wafer holder configured to hold the semiconductor wafer;
an inlet configured to apply liquid on the semiconductor wafer;
a transducer configured to deliver acoustic energy to the liquid;
a power supply of the transducer;
a controller for the power supply comprising a timer, the controller being configured to control the transducer based on the timer to:
deliver acoustic energy to the liquid at a first frequency and a first power level for a predetermined first time period, as determined by the timer, and
deliver no acoustic energy to the liquid for a predetermined second time period, as determined by the timer,
wherein the controller is configured to alternately apply the first and second time periods one after another for a predetermined number of cycles comprising a plurality of amplitudes of a waveform outputted by the power supply; and

a detection system configured to:
detect each amplitude of the waveform outputted by the power supply, and
shut down the power supply when at least one amplitude exceeds a preset amplitude.

17. The apparatus of claim 16 , wherein the detection system is further configured to transmit an alarm signal when the at least one amplitude exceeds the preset amplitude.

18. The apparatus of claim 16 , wherein the detection system comprises:
a voltage attenuation circuit configured to attenuate the plurality of amplitudes of the waveform output by the power supply; and
an amplitude detection circuit configured to:
compare a positive maximum of the attenuated waveform with a first reference voltage, and
compare a negative maximum of the attenuated waveform with a second reference voltage.

19. The apparatus of claim 16 , wherein the transducer is further coupled with the inlet and positioned adjacent to the semiconductor wafer, the acoustic energy of the transducer is transmitted to the semiconductor wafer through the liquid column out of the inlet.

20. An apparatus for cleaning a semiconductor wafer comprising features of patterned structures, the apparatus comprising:
a cassette configured to hold at least one semiconductor wafer;
a tank configured to hold the cassette;

at least one inlet configured to fill liquid into the tank to immerse the semiconducto

Assignees

• Acm Research Shanghai Inc

Inventors

• Wang Jun
• Wang Hui
• Chen Fufa
• Chen Fuping
• Wang Jian
• Wang Xi
• Zhang Xiaoyan
• Jin Yinuo
• Jia Zhaowei
• Xie Liangzhi
• Li Xuejun

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• B08B3/12

  by sonic or ultrasonic vibrations · CPC title