Curable silicone composition, cured product thereof, and optical semiconductor device

Patent metadata

Field	Value
Publication number	US-11248091-B2
Application number	US-201716335833-A
Country	US
Kind code	B2
Filing date	Sep 22, 2017
Priority date	Sep 29, 2016
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula R13SiO1/2 where each R1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO4/2, wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.

First claim

The invention claimed is:

1. A curable silicone composition comprising:
(A) 100 parts by weight of a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups;
(B) 1 to 100 parts by weight of an organopolysiloxane containing siloxane units represented by the general formula R 1 3 SiO 1/2 where each R 1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO 4/2 , wherein the amount of alkenyl groups is at least 10% by weight;
(C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, in an amount that the silicon atom-bonded hydrogen atoms in the component is 0.1 to 10 moles with regard to 1 mole of the total alkenyl groups included in components (A) and (B);
(D) a hydrosilylation reaction catalyst, in an amount that promotes curing of the composition; and
(F) an adhesion promoter, in an amount of 0.01 to 10 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).

2. The curable silicone composition according to claim 1 , further comprising:
(E) a hydrosilylation reaction inhibitor, in an amount of 0.01 to 3 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).

3. A cured product formed by curing the curable silicone composition according to claim 2 .

4. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of the curable silicone composition according to claim 2 .

5. A cured product formed by curing the curable silicone composition according to claim 1 .

6. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of a curable silicone composition comprising:
(A) 100 parts by weight of a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups;
(B) 1 to 100 parts by weight of an organopolysiloxane containing siloxane units represented by the general formula R 1 3 SiO 1/2 where each R 1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO 4/2 wherein the amount of alkenyl groups is at least 10% by weight;
(C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, in an amount that the silicon atom-bonded hydrogen atoms in the component is 0.1 to 10 moles with regard to 1 mole of the total alkenyl groups included in components (A) and (B); and
(D) a hydrosilylation reaction catalyst, in an amount that promotes curing of the composition.

7. The optical semiconductor device according to claim 6 , wherein the curable silicone composition further comprises:
(F) an adhesion promoter, in an amount of 0.01 to 10 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).

8. The optical semiconductor device according to claim 6 , wherein the curable silicone composition further comprises:
(E) a hydrosilylation reaction inhibitor, in an amount of 0.01 to 3 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).

Assignees

• Dow Toray Co Ltd

Inventors

• Hayashi Akito
• Iimura Tomohiro

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title