Electronic device, method and apparatus for producing an electronic device, and composition therefor

Patent metadata

Field	Value
Publication number	US-11240916-B2
Application number	US-201816617959-A
Country	US
Kind code	B2
Filing date	May 31, 2018
Priority date	May 31, 2017
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

First claim

What is claimed is:

1. A method of producing an electronic device including the steps of:
applying an adhesive material in a first pattern on a surface of a first substrate, wherein the adhesive material is electrically conductive; and
applying a metal on top of the adhesive material to secure the metal to the first substrate, wherein applying the metal comprises:
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material;
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred from the second substrate to the first substrate, wherein the applied heat of the activating step heats the adhesive material from approximately 60 degrees Celsius to approximately 160 degrees Celsius and wherein the applied pressure of the activating step is from about 10 psi to about 25 psi;

wherein the metal comprises a conductive trace of an electronic circuit, and wherein the viscosity of the adhesive material of the adhesive applying step is between about 1,000 and about 3,000 mPa-s.

2. The method of claim 1 , wherein the adhesive material comprises a conductive carbon black and two or more polymers, and wherein the conductive carbon black is a non-ionic conductive carbon black dispersion, and wherein the metal is a copper.

3. The method of claim 1 , wherein the adhesive material includes an ethylene acrylic acid copolymer having a molecular weight between about 5,000 and about 30,000 g/mol.

4. The method of claim 1 , wherein the adhesive material includes an aliphatic polyurethane or a styrene butadiene.

5. The method of claim 1 , further comprising the step of curing the adhesive material at a temperature greater of than or equal to about 70 degrees Celsius.

6. The method of claim 1 , wherein the applying step is accomplished using a flexographic printing system.

7. The method of claim 1 , wherein the adhesive material comprises between about 10 and about 40 wt % of conductive carbon black.

8. The method of claim 1 , wherein the adhesive material comprises a conductive carbon black and two or more polymers, wherein one of the two or more polymers comprises ethylene acrylic acid copolymer.

9. The method of claim 1 , wherein the metal is coupled to an electronic component.

10. The method of claim 1 , wherein the adhesive material conducts electricity over localized disruptions of the electrical conductivity of the metal.

11. An adhesive composition comprising:
from about 2 to about 15 wt % of a first polymer;
from about 2 to about 15 wt % of a second polymer;
from about 3 to about 15 wt % of a conductive carbon black dispersion; and
a viscosity modifier,
wherein the first polymer is an ethylene acrylic acid copolymer, the second polymer is an aliphatic polyurethane or a styrene butadiene, and wherein the adhesive composition has a viscosity between about 1,000 mPa-s and about 3,000 mPa-s.

12. The adhesive composition of claim 11 , wherein a ratio of the first polymer to the second polymer is between about 2:1 and about 1:2.

13. The adhesive composition of claim 11 , wherein conductive carbon black comprises between about 10 and 40 wt % after the adhesive composition is dried.

14. The adhesive composition of claim 11 , wherein a ratio of the first polymer and the second polymer to the conductive carbon black dispersion is between about 3:1 and about 1:1.

Assignees

• Cryovac Llc

Inventors

• Blease James W
• Cyman Jr Theodore F

Classifications

• H05K3/046

  by selective transfer or selective detachment of a conductive layer · CPC title

• C09J2423/04

  Presence of homo or copolymers of ethene · CPC title

• H05K3/1208 Primary

  Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H01B1/24 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title