Thermoplastic resin composition, method of preparing the same, and molded part manufactured using the same

US11236224B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11236224-B2
Application numberUS-201716325138-A
CountryUS
Kind codeB2
Filing dateNov 13, 2017
Priority dateSep 19, 2017
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A plated thermoplastic resin composition, the thermoplastic resin composition comprising: a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer, wherein the thermoplastic resin composition is a plating material, and a plating process using a chromium-free etchant is used to plate the thermoplastic resin composition. 2. The plated thermoplastic resin composition according to claim 1 , wherein a weight ratio of the first graft polymer to the second graft polymer is 1:0.5 to 1:4. 3. The plated thermoplastic resin composition according to claim 1 , wherein each of the first and second graft copolymers is obtained by graft-polymerizing 10 to 70% by weight of an aromatic vinyl compound and 1 to 30% by weight of a vinyl cyanide compound onto 20 to 80% by weight of a conjugated diene rubber. 4. The plated thermoplastic resin composition according to claim 1 , wherein the aromatic vinyl compound-vinyl cyanide compound copolymer comprises 10 to 40% by weight of a vinyl cyanide compound. 5. The plated thermoplastic resin composition according to claim 1 , wherein the aromatic vinyl compound-vinyl cyanide compound copolymer has a weight average molecular weight of 50,000 to 200,000 g/mol. 6. The plated thermoplastic resin composition according to claim 1 , wherein the (meth)acrylic acid alkyl ester polymer is obtained by polymerizing one or more selected from methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, and methyl ethacrylate. 7. The plated thermoplastic resin composition according to claim 1 , wherein the (meth)acrylic acid alkyl ester polymer is a block copolymer composed of a (meth)acrylic acid alkyl ester polymer and an aromatic vinyl compound-vinyl cyanide compound copolymer; a master batch of a (meth)acrylic acid alkyl ester polymer using an aromatic vinyl compound-vinyl cyanide compound copolymer as a base resin; or both. 8. The plated thermoplastic resin composition according to claim 1 , wherein the thermoplastic resin composition has a melt index (220° C., 10 kg) of 14 to 40 g/10 min according to ASTM D1238. 9. The plated thermoplastic resin composition according to claim 1 , wherein the thermoplastic resin composition has a plating adhesion of 8.0 N/cm or more. 10. The plated thermoplastic resin composition according to claim 1 , wherein a 6.4 mm thick sample of the composition has an impact strength of 20 kgfcm/cm 2 or more according to ASTM D256. 11. A method of manufacturing a plated part as in claim 1 , wherein the part is a molded part, comprising: a step, in which the thermoplastic resin composition according to claim 1 is subjected to injection molding to obtain an injection-molded part; a step of etching the injection-molded part using the chromium-free etchant, the chromium-free etchant containing KMnO 4 and phosphoric acid; and a step of plating the etched injection-molded part by performing a plating process. 12. The molded and plated part according to claim 11 , wherein the molded part comprises a substrate comprising the thermoplastic resin composition and a plating layer coated on a surface of the substrate, wherein the plating layer is bonded to the substrate via anchoring. 13. A molded and plated part, comprising the plated thermoplastic resin composition according to claim 1 .

Assignees

Inventors

Classifications

  • of chromium · CPC title

  • C08L51/04Primary

    grafted on to rubbers · CPC title

  • Organic substrates, e.g. resin, plastic · CPC title

  • containing four or more polymers in a blend · CPC title

  • C08L25/12Primary

    with unsaturated nitriles · CPC title

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Frequently asked questions

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What does patent US11236224B2 cover?
Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification C08L51/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).