Soldering apparatus and method of fixing gasket to the soldering apparatus

Patent metadata

Field	Value
Publication number	US-11235407-B2
Application number	US-202016788738-A
Country	US
Kind code	B2
Filing date	Feb 12, 2020
Priority date	Feb 26, 2019
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.

First claim

What is claimed is:

1. A soldering apparatus, comprising:
a furnace body including an upper furnace body and a lower furnace body;
a gasket
that is provided to at least a part of the upper furnace body or of the lower furnace body, and
that is positioned between the upper furnace body and the lower furnace body and provides a seal extending between the upper furnace body and the lower furnace body;

a push rivet that fixes the gasket in an attachable/detachable manner to the part of the upper furnace body or of the lower furnace body;
a carry-in port through which boards are carried into the furnace body; and
a carry-out port through which boards are carried out from the furnace body;

wherein
the push rivet includes a rivet body and a pin,
the rivet body includes a flange portion and a leg portion extending from the flange portion,
the flange portion and the leg portion are shaped to receive the pin inserted therein,
the gasket has an elongated shape that extends longitudinally in a direction that is aligned with a board transport direction through the furnace body, and
the gasket extends along a direction in which the carry-in port and the carry-out port are connected to each other.

2. The soldering apparatus according to claim 1 ,
wherein the gasket includes
a first sealing portion,
a fixation portion coupled to the first sealing portion, and
a through-hole formed through the fixation portion, and

wherein the push rivet is inserted into the through-hole.

3. The soldering apparatus according to claim 2 ,
wherein the gasket further includes a second sealing portion coupled to the fixation portion, and
wherein the fixation portion is located between the first sealing portion and the second sealing portion.

4. The soldering apparatus according to claim 3 ,
wherein the first sealing portion and the second sealing portion each have substantially a same thickness.

5. The soldering apparatus according to claim 2 ,
wherein the fixation portion is thinner than the first sealing portion.

6. The soldering apparatus according to claim 5 , further comprising
a holding plate that is fixed between the gasket and the push rivet by the push rivet while in contact with the fixation portion.

7. A method of fixing a gasket to a soldering apparatus, the method comprising:
arranging the gasket in an upper furnace body or a lower furnace body of the soldering apparatus;
fixing the gasket in an attachable/detachable manner to the upper furnace body or the lower furnace body with use of a push rivet with the gasket having an elongated shape that extends longitudinally in a direction that is aligned with a board transport direction through the furnace body, and
sealing between the upper furnace body and the lower furnace body with use of the gasket positioned between the upper furnace body and the lower furnace body and extending between the upper furnace body and the lower furnace body, wherein
the push rivet includes a rivet body and a pin, and the rivet body includes a flange portion and a leg portion extending from the flange portion,
the fixing with use of the push rivet comprises inserting the pin into the flange portion and the leg portion,
the soldering apparatus comprises a carry-in port through which the boards are carried into a furnace body including the upper furnace body and the lower furnace body, and a carry-out port through which the boards are carried out from the furnace body, and
the gasket extends along a direction in which the carry-in port and the carry-out port are connected to each other.

8. The method of fixing the gasket to the soldering apparatus according to claim 7 ,
wherein the fixing of the gasket includes inserting the push rivet into a through-hole formed through a fixation portion coupled to a first sealing portion of the gasket.

9. The method of fixing the gasket to the soldering apparatus according to claim 8 ,
wherein the fixing of the gasket includes inserting the push rivet into the through-hole formed through the fixation portion located between the first sealing portion and a second sealing portion of the gasket.

10. The soldering apparatus according to claim 2 ,
wherein the gasket further includes a second sealing portion coupled to the fixation portion,
wherein the fixation portion is located between the first sealing portion and the second sealing portion, and
wherein the fixation portion is thinner than the first sealing portion.

11. The soldering apparatus according to claim 2 ,
wherein the gasket further includes a second sealing portion coupled to the fixation portion,
wherein the fixation portion is located between the first sealing portion and the second sealing portion, and
wherein the fixation portion is thinner than the second sealing portion.

12. The soldering apparatus according to claim 3 ,
wherein the first sealing portion and the second sealing portion each have substantially a same thickness, and
wherein the fixation portion is thinner than each of the first sealing portion and the second sealing portion.

13. The soldering apparatus according to claim 1 ,
wherein the leg portion comprises a notch extending along an insertion direction of the pin.

14. The soldering apparatus according to claim 1 ,
wherein the leg portion has a tubular shape, and the pin has an outer diameter larger than an inner diameter of the leg portion.

15. The method of fixing the gasket to the soldering apparatus according to claim 7 , further comprising
causing the leg portion to radially expand by inserting the pin into the leg portion.

Assignees

• Senju Metal Industry Co

Inventors

• Hiyama Tsutomu

Classifications

• B23K3/08 Primary

  Auxiliary devices therefor · CPC title

• F16B5/08 Primary

  by means of welds or the like (welding B23K) · CPC title

• B23P19/084

  for placing resilient or flexible rings, e.g. O-rings, circlips · CPC title

• B23K1/008

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• B23K3/00 Primary

  Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods · CPC title