Process for forming metal wires

US11235366B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11235366-B2
Application numberUS-202016984333-A
CountryUS
Kind codeB2
Filing dateAug 4, 2020
Priority dateJan 28, 2020
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A process to fabricate ultra-fine grain metal wire, comprising: inserting a plurality of metal strands into a flexible elastic polyurethane sheath having an accommodating slot for each of the strands of metal to form a sheathed strand assembly; equal channel angular pressing (ECAP pressing) the sheathed strand assembly through an ECAP die having a plurality of die channels corresponding to the plurality of metal strands. The process is designed to improve electric conductance and mechanical properties of elongated metal parts and is especially applicable to optimize the conductance and tensile strength of copper cables, wires, strings, and rods.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process of forming metal wires, comprising: annealing a plurality of metal strands having a thickness (t) at a temperature of 500° C. or greater to form a plurality of annealed metal strands having a minimum bend radius/(t) according to ASTM E 290-14 of <0.4, wherein the metal strands are nickel or copper; curing a polyurethane reaction mixture around the plurality of annealed metal strands to form a sheathed metal strand assembly; equal channel angular pressing (ECAP pressing) the sheathed metal strand assembly through an ECAP die having a die channel having an angle of turning of 90 degrees, to form a plurality of ECAPed metal strands; hydrostatically extruding the plurality of ECAPed metal strands to form a plurality of reduced diameter metal strands; and quenching the plurality of reduced diameter metal strands in water to form the metal wires, wherein the metal wires have a grain size of 120 nm or less. 2. The process of claim 1 , wherein the metal strands are elementally pure copper at >99.99% of Cu element in the metal. 3. The process of claim 1 , wherein the ECAPing is carried out more than once. 4. The process of claim 1 , further comprising: preparing the sheathed metal strand assembly by inserting the annealed strands in the polyurethane reaction mixture prior to the curing. 5. The process of claim 4 , wherein the polyurethane reaction mixture comprises copper fragment, copper chip, copper cuttings or copper powder filler in an amount of 30% to 60% percent by weight of the total weight of the polyurethane reaction mixture. 6. The process of claim 1 , further comprising: ECAP pressing the ECAPed metal strands on a backward-slanted sheathed metal strand assembly. 7. The process of claim 1 , wherein the tensile strength of the water quenched metal strands is at least 70% greater than the tensile strength of the annealed metal strands. 8. The process of claim 4 , wherein the metal strands in the sheathed metal strand assembly are non-circular.

Assignees

Inventors

Classifications

  • Apparatus for manufacturing bond wires · CPC title

  • of bond wires · CPC title

  • B21C23/001Primary

    to improve the material properties, e.g. lateral extrusion · CPC title

  • Manufacture of coated wire or rods · CPC title

  • Extruding materials of special alloys so far as the composition of the alloy requires or permits special extruding methods of sequences · CPC title

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Frequently asked questions

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What does patent US11235366B2 cover?
A process to fabricate ultra-fine grain metal wire, comprising: inserting a plurality of metal strands into a flexible elastic polyurethane sheath having an accommodating slot for each of the strands of metal to form a sheathed strand assembly; equal channel angular pressing (ECAP pressing) the sheathed strand assembly through an ECAP die having a plurality of die channels corresponding to the …
Who is the assignee on this patent?
Univ Prince Mohammad Bin Fahd
What technology area does this patent fall under?
Primary CPC classification B21C23/001. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).