Coated round wire
US-2024368794-A1 · Nov 7, 2024 · US
of bond wires
of bond wires · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/015 |
| Official title | {of bond wires} |
| Display label | of bond wires |
| Total patents | 808 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 61 |
| 2016 | 72 |
| 2017 | 86 |
| 2018 | 104 |
| 2019 | 84 |
| 2020 | 83 |
| 2021 | 64 |
| 2022 | 61 |
| 2023 | 59 |
| 2024 | 67 |
| 2025 | 57 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
US-2024071978-A1 · Feb 29, 2024 · US
Microelectronic package having wire bond vias and stiffening layer
US-2015380375-A1 · Dec 31, 2015 · US
Semiconductor device and method for manufacturing the semiconductor device
US-2015380368-A1 · Dec 31, 2015 · US
Coated wire for bonding applications
US-2015360316-A1 · Dec 17, 2015 · US
Aluminum coated copper ribbon
US-9214444-B2 · Dec 15, 2015 · US
Integrated device comprising wires as vias in an encapsulation layer
US-9209110-B2 · Dec 8, 2015 · US
Semiconductor device and a method of manufacturing the same
US-2015348944-A1 · Dec 3, 2015 · US
Low cte component with wire bond interconnects
US-2015348873-A1 · Dec 3, 2015 · US
Lead frame apparatus and method for improved wire bonding
US-9202797-B1 · Dec 1, 2015 · US
Manufacturing method of semiconductor device and semiconductor device
US-2015333030-A1 · Nov 19, 2015 · US
Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
US-2015327254-A1 · Nov 12, 2015 · US
Integrated device comprising wires as vias in an encapsulation layer
US-2015325496-A1 · Nov 12, 2015 · US
Method of manufacturing semiconductor device
US-9177936-B2 · Nov 3, 2015 · US
Integrated circuit packaging system with embedded component and method of manufacture thereof
US-9171795-B2 · Oct 27, 2015 · US
Aluminum alloy wire for bonding applications
US-2015303165-A1 · Oct 22, 2015 · US
Microelectronic package with stacked microelectronic units and method for manufacture thereof
US-9165911-B2 · Oct 20, 2015 · US
Short tail recovery techniques in wire bonding operations
US-9165842-B2 · Oct 20, 2015 · US
Method for forming chip package
US-2015284244-A1 · Oct 8, 2015 · US
Mim capacitor and method of manufacturing mim capacitor
US-2015279924-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/015?
- CPC H10W72/015 is the Cooperative Patent Classification code for “of bond wires.”
- How many patents are filed under CPC H10W72/015 (of bond wires)?
- Our database includes 808 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/015 growing?
- Publication counts under this code: 67 in 2024 vs 57 in 2025 (latest complete years).