Vapor deposition mask manufacturing method, vapor deposition mask, and organic semiconductor element manufacturing method

Patent metadata

Field	Value
Publication number	US-11233199-B2
Application number	US-201616077045-A
Country	US
Kind code	B2
Filing date	Jul 25, 2016
Priority date	Feb 10, 2016
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal layer formed on the resin layer, the method including the steps of: providing a substrate; forming a resin layer by applying a solution including a resin material or a precursor solution of a resin material on a surface of the substrate, and then performing a heat treatment thereon; forming a magnetic metal layer on the resin layer, mask portion including a solid portion where a metal film is present and a hollow portion where the metal film is absent; forming a plurality of openings in a region of the resin layer that is located in the hollow portion of the mask portion; and removing the resin layer from the substrate after forming a plurality of openings in a region of the resin layer.

First claim

The invention claimed is:

1. A method for manufacturing a vapor deposition mask comprising a resin layer, and a magnetic metal layer formed on the resin layer, the method comprising:
providing a substrate;
forming a resin layer by applying a solution comprising a resin material or a precursor solution of a resin material on a surface of the substrate, and then performing a heat treatment thereon;
forming a magnetic metal layer on the resin layer, wherein the magnetic metal layer comprises a mask portion and a peripheral portion arranged so as to surround the mask portion, the mask portion comprising a solid portion where a metal film is present and a hollow portion where the metal film is absent;
forming a plurality of openings in a region of the resin layer that is located in the hollow portion of the mask portion; and
removing the resin layer from the substrate after forming a plurality of openings;
wherein the hollow portion of the magnetic metal layer comprises a plurality of slits, and the solid portion of the magnetic metal layer comprises a plurality of island-like portions arranged discretely in each of the plurality of slits.

2. The method for manufacturing a vapor deposition mask according to claim 1 , further comprising securing a frame on the peripheral portion of the magnetic metal layer after forming a magnetic metal layer on the resin layer before removing the resin layer from the substrate.

3. The method for manufacturing a vapor deposition mask according to claim 2 , wherein securing the frame on the peripheral portion of the magnetic metal layer is performed after-forming a plurality of openings.

4. The method for manufacturing a vapor deposition mask according to claim 2 , wherein when securing the frame on the peripheral portion of the magnetic metal layer, the frame is secured on the magnetic metal layer with no external tension applied on the magnetic metal layer and the resin layer in any in-plane directions of the layers.

5. The method for manufacturing a vapor deposition mask according to claim 1 , further comprising securing a frame on the peripheral portion of the magnetic metal layer after removing the resin layer from the substrate.

6. The method for manufacturing a vapor deposition mask according to claim 1 , wherein when forming a magnetic metal layer on the resin layer, the solid portion of the mask portion includes a plurality of discretely-arranged island-like portions.

7. A vapor deposition mask manufactured by using a method for manufacturing a vapor deposition mask comprising a resin layer, and a magnetic metal layer formed on the resin layer, the method comprising:
providing a substrate;
forming a resin layer by applying a solution comprising a resin material or a precursor solution of a resin material on a surface of the substrate, and then performing a heat treatment thereon;
forming a magnetic metal layer on the resin layer, wherein the magnetic metal layer comprises a mask portion and a peripheral portion arranged so as to surround the mask portion, the mask portion comprising a solid portion where a metal film is present and a hollow portion where the metal film is absent;
forming a plurality of openings in a region of the resin layer that is located in the hollow portion of the mask portion; and
removing the resin layer from the substrate after forming a plurality of openings;
wherein the hollow portion of the magnetic metal layer comprises a plurality of slits, and the solid portion of the magnetic metal layer comprises a plurality of island-like portions arranged discretely in each of the plurality of slits.

8. A vapor deposition mask comprising a resin layer, and a magnetic metal layer formed on the resin layer, wherein:
the magnetic metal layer comprises a mask portion and a peripheral portion arranged so as to surround the mask portion, the mask portion comprising a solid portion where a metal film is present and a hollow portion where the metal film is absent;
the vapor deposition mask further comprises a frame secured on the peripheral portion of the magnetic metal layer; and
the resin layer has a plurality of openings arranged in the hollow portion of the mask portion, and is not receiving tension in any in-plane directions of the resin layer from the frame;
wherein the hollow portion of the magnetic metal layer comprises a plurality of slits, and the solid portion of the magnetic metal layer comprises a plurality of island-like portions arranged discretely in each of the plurality of slits.

9. The vapor deposition mask according to claim 8 , wherein the frame is formed from a metal or a plastic.

10. The vapor deposition mask according to claim 8 , wherein the resin layer is a layer formed by performing a heat treatment on a solution comprising a resin material or a precursor solution of a resin material applied on a substrate surface.

11. The vapor deposition mask according to claim 8 , wherein the magnetic metal layer is a plating layer or a metal foil.

12. A vapor deposition mask comprising a resin layer, and a magnetic metal layer formed on the resin layer, wherein:
the magnetic metal layer comprises a mask portion and a peripheral portion arranged so as to surround the mask portion, the mask portion comprising a solid portion where a metal film is present and a hollow portion where the metal film is absent; and
the resin layer is a layer formed by performing a heat treatment on a solution comprising a resin material applied on a substrate surface, and has a plurality of openings arranged in the hollow portion of the mask portion;
wherein the hollow portion of the magnetic metal layer comprises a plurality of slits, and the solid portion of the magnetic metal layer comprises a plurality of island-like portions arranged discretely in each of the plurality of slits.

13. A vapor deposition mask comprising a resin layer, and a magnetic metal layer formed on the resin layer, wherein:
the magnetic metal layer comprises a plurality of slits and a plurality of island-like portions arranged discretely in each of the plurality of slits, and a peripheral portion arranged so as to surround the plurality of island-like portions; and
the resin layer has a plurality of openings arranged between the plurality of island-like portions.

14. The vapor deposition mask according to claim 13 , wherein αM is greater than αR, and αM·SM/αR is 0.90 or more and 1.10 or less, where SM (%) denotes an area ratio of the plurality of island-like portions inside the peripheral portion as the magnetic metal layer is seen from a normal direction, αM (ppm/° C.) denotes a linear thermal expansion coefficient of a metal material forming the magnetic metal layer, and αR (ppm/° C.) denotes a linear thermal expansion coefficient of a resin film forming the resin layer.

15. The vapor deposition mask according to claim 14 , wherein SM is 50% or less.

16. A method for manufacturing an organic semiconductor device comprising the step of vapor-depositing an organic semiconductor material on a work by using the vapor deposition mask according to claim 8 .

Assignees

• Hon Hai Prec Ind Co Ltd

Inventors

• Nishida Koshi
• Yano Kozo
• Kishimoto Katsuhiko
• Sakio Susumu
• Takei Hideo

Classifications

• H10K71/166

  using selective deposition, e.g. using a mask · CPC title

• B32B2307/208

  Magnetic, paramagnetic · CPC title

• B32B7/025

  Electric or magnetic properties · CPC title

• B32B3/14

  characterised by a face layer formed of separate pieces of material {which are juxtaposed side-by-side (B32B5/02 takes precedence)} · CPC title

• Y10T428/32

  Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer · CPC title