Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device

Patent metadata

Field	Value
Publication number	US-10557191-B2
Application number	US-201716315327-A
Country	US
Kind code	B2
Filing date	Jan 31, 2017
Priority date	Jan 31, 2017
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

A method for manufacturing a vapor deposition mask (100) including a resin layer (10), and a magnetic metal body (20) formed on the resin layer (10), the method including the steps of: (A) providing a magnetic metal body (20) having at least one first opening (25); (B) providing a substrate (60); (C) forming a resin layer (10) by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate (60), and then performing a heat treatment thereon; (D) securing the resin layer (10) formed on the substrate (60) on the magnetic metal body (20) so as to cover the at least one first opening (25); (E) forming a plurality of second openings (13) in a region of the resin layer (10) that is located in the at least one first opening (25) of the magnetic metal body (20); and (F) after the step (E), removing the substrate (60) from the resin layer (10).

First claim

The invention claimed is:

1. A vapor deposition mask comprising:
a frame;
a magnetic metal body supported on the frame and including at least one first opening;
a resin layer arranged on the magnetic metal body so as to cover the at least one first opening; and
an adhesive layer located between the resin layer and the magnetic metal body for attaching together the resin layer and the magnetic metal body, wherein:
the resin layer has a tensile stress in an layer in-plane direction; and
the magnetic metal body receives a compressive stress in an in-plane direction from the resin layer, wherein:
a width of the at least one first opening is 30 mm or more; and
a maximum bend amount δ of a region of the resin layer that is located in the at least one first opening of the magnetic metal body when the magnetic metal body is held in a horizontal direction is 5 μm or less.

2. The vapor deposition mask of claim 1 , wherein the tensile stress of the resin layer at room temperature is greater than 0.2 MPa.

3. The vapor deposition mask of claim 1 , wherein the adhesive layer is a metal layer fixed on the resin layer, and the metal layer is welded to the magnetic metal body.

4. The vapor deposition mask of claim 1 , wherein:
a width of the at least one first opening is 30 mm or more; and
there is no magnetic metal on a region of the resin layer that is located in the at least one first opening of the magnetic metal body.

5. The vapor deposition mask of claim 1 , wherein the magnetic metal body has an open mask structure.

6. A method for manufacturing an organic semiconductor device comprising the step of vapor-depositing an organic semiconductor material on a work using the vapor deposition mask of claim 1 .

7. A method for manufacturing the vapor deposition mask of claim 1 , the method comprising the steps of:
(A) providing a magnetic metal body having at least one first opening;
(B) providing a substrate;
(C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of the substrate, and then performing a heat treatment thereon;
(D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening;
(E) forming a plurality of second openings in the resin layer; and
(F) after the step (E), removing the substrate from the resin layer, wherein:
a width of the at least one first opening is 30 mm or more; and
where δ denotes a maximum bend amount of a region of the resin layer that is located in the at least one first opening of the magnetic metal body when the magnetic metal body is held in a horizontal direction after the substrate is removed in the step (F),
in the step (C), the heat treatment is performed under such a condition that a tensile stress such that the maximum bend amount δ is 5 μm or less is produced on the resin layer.

8. The manufacturing method of claim 7 , wherein:
where W denotes a width of the at least one first opening, and
where δ denotes a maximum bend amount of a region of the resin layer that is located in the at least one first opening of the magnetic metal body when the magnetic metal body is held in a horizontal direction after the substrate is removed in the step (F),
in the step (C), the heat treatment is performed under such a condition that a tensile stress such that δ/W is 0.01% or less is applied on the resin layer.

9. The manufacturing method of claim 7 , wherein:
the resin layer is a polyimide layer, and the substrate is a glass substrate; and
the heat treatment in the step (C) includes a step of heating the substrate with a solution including the resin material or a varnish of the resin material applied thereon to a temperature of 300° C. or more and 600° C. or less at a rate of 30° C./min or more.

10. The manufacturing method of claim 7 , wherein:
the step (E) is performed after the step (D); and
the plurality of second openings are formed in a region of the resin layer that is located in the at least one first opening of the magnetic metal body.

11. The manufacturing method of claim 7 , wherein the step (E) is performed between the step (C) and the step (D).

12. The manufacturing method of claim 7 , further comprising the step of providing a frame along a peripheral edge portion of the magnetic metal body.

13. The manufacturing method of claim 7 , wherein in the step (C), the heat treatment is performed under such a condition that a tensile stress greater than 0.2 MPa is produced on the resin layer at room temperature in a layer in-plane direction.

14. The manufacturing method of claim 7 , wherein a compressive stress is applied on the magnetic metal body from the resin layer after the substrate is removed in the step (F).

15. The manufacturing method of claim 7 , wherein the step (D) includes the steps of:
(D1) forming an adhesive layer on a portion of the resin layer; and
(D2) attaching the resin layer to the magnetic metal body with the adhesive layer therebetween.

16. The manufacturing method of claim 15 , wherein:
the adhesive layer is a metal layer; and
the step (D2) is a step of welding the metal layer to the magnetic metal body, thereby attaching the resin layer to the magnetic metal body with the metal layer therebetween.

17. The manufacturing method of claim 7 , wherein a width of the at least one first opening is 30 mm or more, and there is no magnetic metal on a region of the resin layer that is located in the at least one first opening of the magnetic metal body.

18. A vapor deposition mask comprising:
a frame;
a magnetic metal body supported on the frame and including at least one first opening;
a resin layer arranged on the magnetic metal body so as to cover the at least one first opening; and
an adhesive layer located between the resin layer and the magnetic metal body for attaching together the resin layer and the magnetic metal body, wherein:
the resin layer has a tensile stress in an layer in-plane direction; and
the magnetic metal body receives a compressive stress in an in-plane direction from the resin layer, wherein:
δ/W is 0.01% or less, where W denotes a width of the at least one first opening, and δ denotes a maximum bend amount of a region of the resin layer that is located in the at least one first opening of the magnetic metal body when the magnetic metal body is held in a horizontal direction.

19. A method for manufacturing the vapor deposition mask of claim 18 , the method comprising the steps of:
(A) providing a magnetic metal body having at least one first opening;
(B) providing a substrate;
(C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of the substrate, and then performing a heat treatment thereon;
(D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening;
(E) forming a plurality of second openings in the resin layer; and
(F) after the step (E), removing the substrate from the resin layer, wherein:
where W denotes a width of the at least one first opening, and
where δ denotes a maximum bend amount of a region of the resin layer that is located in the at least one first opening of the magnetic metal body when the magnetic metal body is held in a horizontal direction after the substrate is removed in the step (F),
in the step (C), the heat treatment is performed under such a condition that a tensile stress such that δ/W is 0.01% or less is applied on the resi

Assignees

• Sakai Display Products Corp

Inventors

• Nishida Koshi
• Sakio Susumu
• Kishimoto Katsuhiko

Classifications

• C23C14/042 Primary

  using masks · CPC title

• H01L51/56

  Electricity · mapped topic

• H01L51/00

  Electricity · mapped topic

• H01L51/0011

  Electricity · mapped topic

• C23C14/24

  Vacuum evaporation · CPC title