Resin composition

Patent metadata

Field	Value
Publication number	US-11230617-B2
Application number	US-201816759886-A
Country	US
Kind code	B2
Filing date	Oct 30, 2018
Priority date	Oct 31, 2017
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pK a of 8 or greater. The 2-methylene-1,3-dicarbonyl compound contains a structural unit represented by the following formula (I)

First claim

What is claimed is:

1. A one-part liquid resin composition comprising a 2-methylene-1,3-dicarbonyl compound and an initiator,
wherein the 2-methylene-1,3-dicarbonyl compound is a compound comprising a structural unit represented by formula (I) below:

and having a molecular weight of 180 to 10,000; and
wherein the initiator comprises a basic substance having a pK a of 8 or greater.

2. The one-part liquid resin composition according to claim 1 , wherein the 2-methylene-1,3-dicarbonyl compound has a molecular weight of 260 to 1,500.

3. The one-part liquid resin composition according to claim 1 , wherein the initiator comprises a basic substance having a pK a of 9 or greater.

4. The one-part liquid resin composition according to claim 1 , wherein the basic substance is an amine compound.

5. The one-part liquid resin composition according to claim 4 , wherein the amine compound has an amine functional group equivalent weight of less than 180.

6. The one-part liquid resin composition according to claim 4 , wherein the amine compound has an amine functional group equivalent weight of less than 140.

7. The one-part liquid resin composition according to claim 4 , wherein the amine compound comprises a secondary or tertiary amino group.

8. The one-part liquid resin composition according to claim 4 , wherein the amine compound comprises a tertiary amino group.

9. The one-part liquid resin composition according to claim 4 , wherein the amine compound is liquid at 80° C.

10. The one-part liquid resin composition according to claim 4 , wherein the amine compound is liquid at 25° C.

11. The one-part liquid resin composition according to claim 1 , wherein the basic substance is comprised in an amount of 0.01 to 30 mol % relative to the 2-methylene-1,3-dicarbonyl compound.

12. The one-part liquid resin composition according to claim 1 , for use in the manufacture of an electronic component.

13. A method for producing a semiconductor device having an electronic component and a circuit board, the method comprising:
providing the electronic component and the circuit board;
applying the one-part liquid resin composition according to claim 1 to a surface of the electronic component or the circuit board; and
contacting the electronic component and the circuit board.

14. A method for producing a sealed electronic component, the method comprising:
providing an electronic component; and
sealing the electronic component using the one-part liquid resin composition according to claim 1 .

15. A method for producing an electronic component, the method comprising:
providing a plurality of members to be incorporated in the electronic component;
applying the one-part liquid resin composition according to claim 1 to a surface of a member to be incorporated in the electronic component; and
contacting the member with another member to be incorporated in the electronic component.

16. A method for producing a member to be incorporated in an electronic component, the method comprising:
providing a circuit board comprising an electronic circuit; and
applying the one-part liquid resin composition according to claim 1 onto the electronic circuit on the circuit board.

Assignees

• Namics Corp

Inventors

• Arai Fuminori
• Iwaya Kazuki

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title