Device transferring apparatus

Patent metadata

Field	Value
Publication number	US-11230076-B2
Application number	US-201916445734-A
Country	US
Kind code	B2
Filing date	Jun 19, 2019
Priority date	Jul 25, 2018
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

The present disclosure provides a device transferring apparatus and a device transferring method, comprising: a controlling component and a punching component, the punching component is located at one side of the controlling component; the punching component comprises at least one punching head movable in a first direction; and the controlling component comprises a protruding portion corresponding to the at least one punching head and capable of protruding toward the corresponding punching head, the protruding portion pushes the punching head to move in the first direction by protruding the protruding portion.

First claim

What is claimed is:

1. A device transferring apparatus, comprising: a controlling component and a punching component, wherein the punching component is located at one side of the controlling component; wherein
the punching component comprises at least one punching head movable in a first direction; and
the controlling component comprises a protruding portion corresponding to the at least one punching head and capable of protruding toward the corresponding punching head, the protruding portion pushes the punching head to move in the first direction by protruding the protruding portion, wherein
the controlling component further comprises a microfluidic control substrate; and
the microfluidic control substrate comprises a cavity for containing a fluid, the cavity has an inflow port and at least one outflow port, the outflow port is located at a side of the cavity facing the punching component, the outflow port is corresponding to the protruding portion, the fluid flowing out from the outflow port is able to push the protruding portion to protrude toward the corresponding punching head, and wherein
the side of the cavity facing the punching component is covered with a flexible film, and a portion of the flexible film covering the outflow port constitutes the protruding portion.

2. The device transferring apparatus according to claim 1 , wherein
the punching component further comprises a support member, a side of the support member facing the controlling component is provided with at least one receiving groove corresponding to the punching head, and a bottom of the receiving groove has a through hole penetrating the support member; and
the punching head is located in the corresponding receiving groove, and an end of the punching head facing away from the protruding portion protrudes through the through hole when the protruding portion pushes the punching head to move in the first direction.

3. The device transferring apparatus according to claim 2 , wherein
the punching head comprises a force receiving portion and a protrusion integral with the force receiving portion, the force receiving portion is located between the protrusion and the corresponding protruding portion; and
the through hole is configured to restrict movement of the force receiving portion in the first direction without restricting movement of the protrusion in the first direction.

4. The device transferring apparatus according to claim 3 , wherein
a cross-sectional area of the force receiving portion in a cross section perpendicular to the first direction is larger than a cross-sectional area of the protrusion in a cross section perpendicular to the first direction; and
the cross-sectional area of the force receiving portion in the cross section perpendicular to the first direction is larger than a cross-sectional area of the through hole in a cross section perpendicular to the first direction.

5. The device transferring apparatus according to claim 4 , wherein
the punching component further comprises an elastic member; and
the elastic member is disposed between the force receiving portion and the bottom of the receiving groove, so as to provide a biasing force for the punching head relative to the receiving groove.

6. The device transferring apparatus according to claim 3 , wherein
a side of the punching component facing away from the controlling component is provided with a flexible substrate.

7. The device transferring apparatus according to claim 6 , wherein the number of the punching heads is plural.

8. The device transferring apparatus according to claim 7 , wherein the outflow port has a plurality of holes, and all the holes located at the same outflow port are uniformly arranged.

Assignees

• Beijing Boe Display Tech Co
• Boe Technology Group Co Ltd

Inventors

• Wang Fei
• Xu Wanxian
• Dong Xue

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07307

  the auxiliary member being a temporary substrate, e.g. a removable substrate · CPC title