Micro device transferring apparatus and micro device transferring method

Patent metadata

Field	Value
Publication number	US-10937559-B2
Application number	US-201916553885-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Mar 8, 2019
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A micro device transferring apparatus and a micro device transferring method are provided. The micro device transferring apparatus for moving a micro device fixed on an original substrate to a target substrate includes: a stripper on a side of the original substrate away from the micro device, configured to strip the micro device off the original substrate, and an optical tweezer configured to tweeze the micro device from a side of the original substrate provided with the micro device, wherein an accommodating space for accommodating the micro device and the original substrate is between the stripper and the optical tweezer.

First claim

The invention claimed is:

1. A micro device transferring apparatus for moving a micro device fixed on an original substrate to a target substrate, the apparatus comprising:
a stripper on a side of the original substrate away from the micro device, configured to strip the micro device off the original substrate; and
an optical tweezer configured to tweeze the micro device from a side of the original substrate provided with the micro device, wherein an accommodating space between the stripper and the optical tweezer is for accommodating the micro device and the original substrate.

2. The micro device transferring apparatus according to claim 1 , wherein the optical tweezer is a laser optical tweezer.

3. The micro device transferring apparatus according to claim 1 , further comprising:
an auxiliary substrate configured to assist in transferring the micro device;
wherein the auxiliary substrate is between the micro device and the optical tweezer, and a surface of the auxiliary substrate facing the micro device is configured to contact with the micro device.

4. The micro device transferring apparatus according to claim 3 , wherein a material of the auxiliary substrate is transparent plastic or glass.

5. The micro device transferring apparatus according to claim 4 , wherein the surface of the auxiliary substrate facing the micro device is provided with a bonding layer for bonding the micro device, and the micro device is bonded with the auxiliary substrate through the bonding layer.

6. The micro device transferring apparatus according to claim 4 , wherein the surface of the auxiliary substrate facing the micro device is configured to contact with the micro device by a force applied by the optical tweezer through the auxiliary substrate to micro device.

7. The micro device transferring apparatus according to claim 3 , wherein a pressuring plate is between the optical tweezer and the auxiliary substrate, and the pressuring plate is configured to apply a force to the auxiliary substrate in a direction toward the micro device.

8. The micro device transferring apparatus according to claim 1 , wherein the stripper is a laser stripper.

9. A micro device transferring method, comprising:
stripping a micro device off an original substrate using a stripper on a side of the original substrate away from the micro device;
moving the micro device separated from the original substrate to a target substrate using an optical tweezer on a side of the micro device away from the original substrate; and
fixing the micro device on the target substrate using a connection material on the target substrate.

10. The micro device transferring method according to claim 9 , wherein the connection material is a bonding agent, tin paste, silver slurry, or metal.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Fei
• Wang Huijuan
• Xu Wanxian
• Liang Xuan
• Wang Meili

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• G21K1/30 Primary

  for confining neutral particles or handling confined neutral particles, e.g. atom traps · CPC title