System comprising a package having optically isolated micromachined (MEMS) switches with a conduit to route optical signal to an optical receiver and related methods

Patent metadata

Field	Value
Publication number	US-11228310-B2
Application number	US-202017080785-A
Country	US
Kind code	B2
Filing date	Oct 26, 2020
Priority date	Mar 15, 2018
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

First claim

What is claimed is:

1. A system comprising:
a package comprising:
a micro-electromechanical system (MEMS) structure including a control terminal; and
an optical receiver coupled to the control terminal;

a light transmitting medium; and
a conduit extending from inside the package to outside the package, the conduit configured to route an optical signal to the optical receiver through the light transmitting medium.

2. The system of claim 1 , wherein the package is a chip scale package.

3. The system of claim 2 , wherein the MEMS structure and the optical receiver are disposed on a common chip within the chip scale package.

4. The system of claim 1 , wherein the conduit comprises the light transmitting medium.

5. The system of claim 4 , wherein the conduit and the light transmitting medium are configured such that the optical receiver receives the optical signal after it has passed through the light transmitting medium.

6. The system of claim 1 , wherein the conduit is configured to receive the optical signal from a light source external to the system.

7. The system of claim 6 , wherein the conduit is configured to receive an optical fiber cable configured to route the optical signal from the light source to the conduit.

8. The system of claim 1 , wherein the receiver is configured to control the MEMS structure based on the optical signal.

9. The system of claim 8 , wherein the optical receiver is configured to control the MEMS structure by outputting a voltage at the control terminal in response to receiving the optical signal.

10. The system of claim 1 , wherein the light transmitting medium comprises an optical filter configured to filter at least one wavelength of light.

11. A method for controlling a micro-electromechanical system (MEMS) structure disposed in a package, the method comprising:
routing an optical signal using a conduit through a light transmitting medium to an optical receiver disposed in the package, wherein the conduit extends from inside the package to outside the package; and
with the optical receiver, controlling the MEMS structure based on the optical signal received at the optical receiver.

12. The method of claim 11 , wherein the package is chip scale packaging and wherein the MEMS structure and the optical receiver are disposed on one or more chips within the chip scale packaging.

13. The method of claim 11 , further comprising routing the optical signal using the conduit from a light source external to the package.

14. The method of claim 11 , further comprising filtering, by the light transmitting medium, at least one wavelength of light.

15. A system comprising:
a package comprising:
a micro-electromechanical system (MEMS) structure including a control terminal; and
at least one optical receiver coupled to the control terminal; and

a plurality of conduits extending from inside the package to outside the package, the plurality of conduits comprising respective light transmitting mediums and the plurality of conduits configured to route a plurality of optical signals to the at least one optical receiver.

16. The system of claim 15 , wherein the package is a chip scale package and wherein the MEMS structure and the at least one optical receiver are disposed on one or more chips within the chip scale package.

17. The system of claim 15 , wherein the plurality of conduits comprises:
a first conduit configured to route a first one of the plurality of optical signals to the at least one optical receiver, the first optical signal having a first wavelength; and
a second conduit configured to route a second one of the plurality of optical signals to the at least one optical receiver, the second optical signal having a second wavelength.

18. The system of claim 17 , wherein a first light transmitting medium of the first conduit comprises a first optical filter and a second light transmitting medium of the second conduit comprises a second optical filter.

19. The system of claim 15 , wherein the plurality of conduits are configured to operate in parallel.

20. The system of claim 15 , wherein:
the at least one optical receiver comprises a plurality of optical receivers; and
each of at least some of the plurality of conduits is configured to route a respective one of the plurality of optical signals to a respective one of the plurality of optical receivers.

Assignees

• Analog Devices Global Unlimited Co

Inventors

• Zhao Ying
• O'Donnell Alan
• Twohig Michael James
• Kierse Olly J
• Sheeran James Thomas
• Coln Michael C W
• Stevens Paul W
• Hecht Bruce A
• Fitzgerald Padraig
• Schirmer Mark

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• H03K17/943 Primary

  using a plurality of optical emitters or detectors, e.g. keyboard · CPC title

• H01H59/0009

  making use of micromechanics · CPC title