Optical I/O system using planar light-wave integrated circuit

Patent metadata

Field	Value
Publication number	US-10054737-B2
Application number	US-201615352520-A
Country	US
Kind code	B2
Filing date	Nov 15, 2016
Priority date	Dec 30, 2011
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.

First claim

The invention claimed is:

1. An apparatus, comprising:
a processor package substrate, the substrate having electrical connections to interface with a printed circuit board;
a processor die coupled to the package substrate;
transceiver logic coupled to the processor die on the package substrate, the transceiver logic to provide electrical signal exchange between electrical-optical circuits and the processor die;
the electrical-optical circuits coupled using through silicon vias (TSVs) to the transceiver logic, the electrical-optical circuits to convert between the electrical signal and a corresponding optical signal;
an optical coupler coupled to the package substrate and coupled to the electrical-optical circuits to transfer the optical signal between the electrical-optical circuits and an optical fiber connector for an optical fiber that extends off of the processor package; and an interface including a mirror to redirect the optical signal from the package substrate to the optical coupler.

2. The apparatus of claim 1 , further comprising a planar light-wave circuit (PLC) coupled to the processor die, the PLC including the electrical-optical circuits.

3. The apparatus of claim 1 , wherein the processor die is coupled to the package substrate with through-silicon vias (TSVs).

4. The apparatus of claim 1 , wherein the processor die is coupled to the package substrate through a planar light-wave chip (PLC) with through-silicon vias (TSVs).

5. The apparatus of claim 1 , wherein the transceiver logic is integrated onto the processor die.

6. The apparatus of claim 1 , wherein the electrical-optical circuits include at least one laser and at least one photodetector.

7. The apparatus of claim 6 , wherein the electrical-optical circuits further include at least one modulator.

8. The apparatus of claim 1 , wherein the electrical-optical circuits include a planar light-wave chip (PLC).

9. The apparatus of claim 8 , wherein the electrical-optical circuits include waveguide elements integrated into the package substrate.

10. The apparatus of claim 8 , wherein the PLC further includes one or more of a chip including the transceiver logic, a laser chip, or the optical coupler disposed on the PLC, connected to the substrate with through-silicon vias (TSVs).

11. The apparatus of claim 1 , wherein the optical coupler comprises a two-dimensional lens array.

12. A processor comprising:
a package substrate;
a processor die coupled to the package substrate; and
a planar light-wave circuit (PLC) coupled to the processor die, the PLC including electrical-optical circuits coupled through the PLC using through-silicon vias (TSVs) to transceiver logic, the electrical-optical circuits to convert between an electrical signal and a corresponding optical signal, wherein the electrical-optical circuits include a laser to produce light and a modulator to generate the optical signal using the light, and
an optical coupler coupled through the PLC using through-silicon vias (TSVs) to the package substrate and coupled to the electrical-optical circuits to transfer the optical signal between the electrical-optical circuits and an optical fiber connector for an optical fiber that extends off of the processor, wherein the optical coupler is integrated to the PLC and includes a mirror to redirect the optical signal from the PLC to the optical coupler.

13. The processor of claim 12 , wherein at least part of the PLC is integrated into the package substrate.

14. The processor of claim 12 , wherein the transceiver logic includes a transceiver logic chip disposed on the PLC.

15. The processor of claim 12 , wherein the processor die includes transceiver logic integrated onto the processor die.

16. The processor of claim 12 , wherein the electrical-optical circuits include waveguide elements integrated into the PLC.

17. The processor of claim 12 , wherein the optical coupler comprises a two-dimensional lens array.

18. The processor of claim 12 , wherein a first wave guide extends from the transceiver to the interface along the PLC and provides the optical signal to the mirror which reflects the optical signal away from the PLC and into the optical coupler.

19. A computing system, comprising:
a processor including
a processor package substrate, the substrate having electrical connections to interface with a printed circuit board;
a processor die coupled to the package substrate;
transceiver logic coupled to the processor die on the package substrate, the transceiver logic to provide electrical signal exchange between electrical-optical circuits and the processor die;
the electrical-optical circuits coupled using through silicon vias (TSVs) to the transceiver logic, the electrical-optical circuits to convert between the electrical signal and a corresponding optical signal; and
an optical coupler coupled to the package substrate and coupled to the electrical-optical circuits to transfer the optical signal between the electrical-optical circuits and an optical fiber connector for an optical fiber that extends off of the processor package;
an interface including a mirror to redirect the optical signal from the package substrate to the optical coupler; and
a fiber connector including a single-mode fiber to couple to the optical coupler.

20. The computing system of claim 19 , further comprising a planar light-wave circuit (PLC) coupled to the processor die, the PLC including the electrical-optical circuits.

21. The computing system of claim 19 , wherein the processor die is coupled to the package substrate with through-silicon vias (TSVs).

22. The computing system of claim 19 , wherein the processor die is coupled to the package substrate through a planar light-wave chip (PLC) with through-silicon vias (TSVs).

23. The computing system of claim 19 , wherein the transceiver logic is integrated onto the processor die.

24. The computing system of claim 19 , wherein the electrical-optical circuits include waveguide elements integrated into the package substrate.

25. The computing system of claim 19 , wherein the optical coupler comprises a two-dimensional lens array.

Assignees

• Intel Corp

Inventors

• Kobrinsky Mauro J
• Braunisch Henning
• Liff Shawna M
• Chang Peter L
• Block Bruce A
• Swan Johanna M

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H10W72/07331

  Connecting techniques · CPC title