Electronic control unit
US-11051430-B2 · Jun 29, 2021 · US
Heat radiating member and electrical junction box
US11227811B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11227811-B2 |
| Application number | US-201916665407-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 28, 2019 |
| Priority date | Nov 9, 2018 |
| Publication date | Jan 18, 2022 |
| Grant date | Jan 18, 2022 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, includes a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device. The recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion.
First claim
Opening claim text (preview).
What is claimed is: 1. An electrical junction box comprising: a heat radiating member that receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, the heat radiating member including: a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device, wherein the recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion; an accommodating portion configured to accommodate the substrate portion; and a heat conductive material interposed between the substrate portion and the opposing plate portion of the heat radiating member. 2. The electrical junction box as set forth in claim 1 , wherein a wall portion of the recessed portion excluding a bottom portion has a wall thickness that is greater than that of another portion of the opposing plate portion. 3. The electrical junction box as set forth in claim 1 , wherein an elongated wall portion of a wall portion of the recessed portion excluding a bottom portion, the elongated wall portion extending in a longitudinal direction of the recessed portion, has a wall thickness that is greater than that of another portion of the opposing plate portion. 4. The electrical junction box as set forth in claim 1 , further comprising: a radiation fin that is flush with an outer face of the elongated wall portion and is continuous with an end portion of the elongated wall portion.
Assignees
Inventors
Classifications
Arrangements for heating · CPC title
Package configurations · CPC title
Interconnections or connectors in packages · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11227811B2 cover?
- A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received hea…
- Who is the assignee on this patent?
- Sumitomo Wiring Systems
- What technology area does this patent fall under?
- Primary CPC classification H10W40/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).