Chip-scale coherent lidar with integrated high power laser diode

Patent metadata

Field	Value
Publication number	US-11226403-B2
Application number	US-201815957974-A
Country	US
Kind code	B2
Filing date	Apr 20, 2018
Priority date	Jul 12, 2017
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A chip-scale coherent lidar system includes a master oscillator integrated on a chip to simultaneously provide a signal for transmission and a local oscillator (LO) signal. The system also includes a beam steering device to direct an output signal obtained from the signal for transmission out of the system, and a combiner on the chip to combine the LO signal and a return signal resulting from a reflection of the output signal by a target. One or more photodetectors obtain a result of interference between the LO signal and the return signal to determine information about the target.

First claim

What is claimed is:

1. A chip-scale coherent lidar system, comprising:
a master oscillator integrated on a chip and configured to simultaneously provide a signal for transmission and a local oscillator (LO) signal;
a beam steering device configured to direct an output signal obtained from the signal for transmission out of the system;
a combiner on the chip configured to combine the LO signal and a return signal resulting from a reflection of the output signal by a target; and
one or more photodetectors configured to obtain a result of interference between the LO signal and the return signal to determine information about the target, wherein the system includes an amplifier to amplify the signal for transmission to produce the output signal and the output signal has an output power on the order of 500 milliwatts (mW) and the LO signal has an output power on the order of 5 mW.

2. The system according to claim 1 , wherein the master oscillator includes a gain medium that is modulated by a current source to provide a frequency modulated continuous wave (FMCW) signal.

3. The system according to claim 2 , wherein the current source is off the chip.

4. The system according to claim 2 , wherein the master oscillator also includes a first mirror to output the signal for transmission and a second mirror to output the LO signal.

5. The system according to claim 4 , wherein the first mirror is a low-reflectivity mirror and the second mirror is a high-reflectivity mirror.

6. The system according to claim 5 , wherein a reflectivity of the first mirror is 5-10 percent, and the reflectivity of the second mirror is 80-90 percent.

7. The system according to claim 4 , wherein the amplifier is a semiconductor optical amplifier on the chip with an off-chip current source.

8. The system according to claim 2 , wherein the master oscillator is a distributed Bragg reflector laser diode (DBR-LD).

9. The system according to claim 1 , wherein the one or more photodetectors is a germanium-on-silicon (Ge-on-Si) photodetectors.

10. The system according to claim 1 , wherein the system is a monostatic system and further comprises a circulator.

11. The system according to claim 1 , wherein the system is bistatic.

12. The system according to claim 1 , wherein the system is within or on a vehicle and is configured to detect a location and speed of an object relative to the vehicle.

13. A method of assembling a coherent lidar system, the method comprising:
integrating a master oscillator and an optical amplifier on a chip to simultaneously provide an output signal and a local oscillator (LO) signal, wherein the master oscillator includes a gain medium, a first mirror, and a second mirror, wherein the optical amplifier produces the output signal with an output power on the order of 500 milliwatts (mW) and the LO signal with an output power on the order of 5 mW; and
arranging a first current source to supply the gain medium and a second current source to supply the optical amplifier.

14. The method according to claim 13 , further comprising arranging the first mirror to pass through a transmit signal from the gain medium to the optical amplifier and arranging the second mirror to pass through the LO signal from the gain medium.

15. The method according to claim 13 , further comprising configuring the first current source to modulate a frequency of the gain medium.

16. A vehicle, comprising:
chip-scale coherent lidar system, comprising:
a master oscillator integrated on a chip and configured to simultaneously provide a signal for transmission and a local oscillator (LO) signal;
a beam steering device configured to direct an output signal obtained from the signal for transmission out of the system, wherein the chip-scale coherent lidar system includes an amplifier to amplify the signal for transmission to produce the output signal and the output signal has an output power on the order of 500 milliwatts (mW) and the LO signal has an output power on the order of 5 mW;
a combiner on the chip configured to combine the LO signal and a return signal resulting from a reflection of the output signal by a target; and
one or more photodetectors configured to obtain a result of interference between the LO signal and the return signal to determine information about the target; and
a controller configured to augment or automate operation of the vehicle based on information obtained from the return signal in the lidar system.

17. The vehicle according to claim 16 , wherein the master oscillator includes a gain medium that is modulated by a current source to provide a frequency modulated continuous wave (FMCW) signal.

18. The vehicle according to claim 17 , wherein the master oscillator also includes a first mirror to output the signal for transmission and a second mirror to output the LO signal, and the system also includes an amplifier to amplify the signal for transmission to produce the output signal.

19. The vehicle according to claim 18 , wherein the first mirror is a low-reflectivity mirror and the second mirror is a high-reflectivity mirror.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Sayyah Keyvan
• Sarkissian Raymond
• Efimov Oleg
• Patterson Pamela R

Classifications

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• G02B6/1228

  Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305) · CPC title

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title