Porous copper composite and method thereof

Patent metadata

Field	Value
Publication number	US-11225044-B2
Application number	US-201916391737-A
Country	US
Kind code	B2
Filing date	Apr 23, 2019
Priority date	Mar 1, 2019
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.

First claim

What is claimed is:

1. A method for making a porous copper composite, comprising:
S 10 , providing a carbon nanostructure reinforced copper composite substrate, and plating a salt solution of an active metal on a surface of the carbon nanostructure reinforced copper composite substrate to form an active metal layer and obtain a composite substrate, wherein the carbon nanostructure reinforced copper composite substrate comprises a copper substrate and a carbon nanostructure, the carbon nanostructure is disposed on a surface of the copper substrate, the carbon nanostructure comprises a plurality of carbon nanotubes, and the salt solution of the active metal comprises a plurality of active metal atoms located in gaps between adjacent carbon nanotubes;
S 20 , stacking at least two composite substrates to form a first composite structure;
S 30 , pressing the first composite structure to form a second composite structure;
S 40 , annealing the second composite structure to form a third composite structure, wherein an annealing process of the second composite structure comprises steps: (S 401 ) heating the second composite structure at a temperature higher than 300° C. to thermally diffuse atoms of the copper substrate and the active metal layer; (S 402 ) annealing and cooling the second composite structure to make the plurality of active metal atoms and a plurality of copper atoms form an alloy; and
S 50 , dealloying the third composite structure to form a porous copper composite.

2. The method of claim 1 , wherein a volume fraction of the carbon nanostructure in the composite substrate is less than or equal to 70%.

3. The method of claim 1 , wherein the carbon nanostructure comprises at least one carbon nanotube film or at least one graphene film.

4. The method of claim 1 , wherein step S 30 further comprises a process of alternatively folding and pressing the second composite structure.

5. The method of claim 4 , wherein in each folding and pressing process, a thickness of the first composite structure after pressing is reduced to less than 70% of a thickness of the first composite structure after folding.

6. The method of claim 4 , wherein the folding and pressing process is repeated at least two times.

7. The method of claim 1 , wherein further comprises the step of scraping the surfaces of the copper substrate and the active metal layer to expose fresh surface of the copper substrate and the active metal layer before step S 10 after step S 20 .

8. The method of claim 7 , wherein an exposed fresh surface of the active metal layer is directly in contact with an exposed fresh surface of the copper substrate.

9. The method of claim 1 , wherein the alloy is directly grown on surfaces of the plurality of carbon nanotubes during a annealing process in S 40 .

10. The method of claim 9 , wherein an interface between the plurality of carbon nanotubes and the alloy is a coherent or semi-coherent interface.

11. The method of claim 1 , wherein the alloy consists of the plurality of active metal atoms and the plurality of copper atoms.

12. The method of claim 1 , wherein the second composite structure is annealed at a temperature 500° C. for 24 hours, and Zn atoms and Cu atoms are diffused to form the alloy with homogenous composition.

13. The method of claim 1 , wherein the salt solution of the active metal is a ZnSO 4 solution, and the active metal layer is a zinc film.

14. The method of claim 1 , wherein an atomic ratio of copper to the active metal is in a rang from 2:8 to 8:2.

Assignees

• Univ Tsinghua
• Hon Hai Prec Ind Co Ltd

Inventors

• Liu Yuan-Feng
• Hou Ze-Cheng
• Chen Lu
• Zhu Lin
• Li Wen-Zhen

Classifications

• B21D5/02

  on press brakes without making use of clamping means · CPC title

• C22C1/08 Primary

  Alloys with open or closed pores · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• B32B15/01 Primary

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• B21B47/00

  Auxiliary arrangements, devices or methods in connection with rolling of multi-layer sheets of metal (soaking pits C21D9/70) · CPC title