Method for making nanoporous copper

Patent metadata

Field	Value
Publication number	US-2019203376-A1
Application number	US-201816137570-A
Country	US
Kind code	A1
Filing date	Sep 21, 2018
Priority date	Dec 29, 2017
Publication date	Jul 4, 2019
Grant date	—

Abstract

A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.

First claim

What is claimed is:

1 . A method of making a nanoporous copper comprising:
step (S 1 ), providing a copper alloy layer and at least one active metal layer, wherein the copper alloy layer comprises a first surface and a second surface; step (S 2 ), placing the at least one active metal layer on both the first surface and the second surface of the copper alloy layer to sandwich the copper alloy layer and form a structure; step (S 3 ), pressing the structure to form a composite structure; step (S 4 ), repeating a process of alternatively folding and pressing the composite structure to form a precursor; and step (S 5 ), corroding the precursor to form the nanoporous copper.

2 . The method of claim 1 , wherein a material of the copper alloy layer comprises copper and active metal.

3 . The method of claim 2 , wherein the active metal is selected from zinc, aluminum, and nickel.

4 . The method of claim 1 , wherein a thickness of the copper alloy layer is about 0.03 millimeters to about 3 millimeters.

5 . The method of claim 1 , wherein the copper alloy layer comprises a reinforcement, and the reinforcement is dispersed in the copper alloy layer.

6 . The method of claim 5 , wherein a material of the reinforcement is selected from carbon nanotube structure, graphene, aluminum oxide, and silicon nitride.

7 . The method of claim 1 , wherein a material of the at least one active metal layer is selected from zinc, aluminum, and nickel.

8 . The method of claim 1 , wherein the copper alloy layer comprises copper and an alloy element, and a material of the at least one active metal layer is the same as the alloy element in the copper alloy layer.

9 . The method of claim 1 , further comprising degreasing the at least one active metal layer before placing the at least one active metal layer on the first surface and the second surface.

10 . The method of claim 1 , wherein the number of the at least one active metal layer is one, step (S 2 ) comprises folding the active metal layer into a “U” type first, and then placing the copper alloy layer on a hollow portion of the “U” type to form the structure.

11 . The method of claim 1 , wherein the number of the at least one active metal layer is larger than or equal to two, step (S 2 ) comprises placing at least one active metal layer on the first surface and at least one active metal layer on the second surface to form the structure.

12 . The method of claim 1 , further comprising a step of tailoring an edge of the structure after step (S 2 ) and before step (S 3 ).

13 . The method of claim 1 , wherein pressing the structure to form the composite structure makes a thickness of the composite structure less than or equal to 70% of a thickness of the structure.

14 . The method of claim 1 , wherein the process of alternatively folding and pressing the composite structure comprises: first folding the composite structure to form a folded composite structure, and then pressing the folded composite structure.

15 . The method of claim 14 , wherein repeating the process of alternatively folding and pressing the composite structure for 2˜10 times.

16 . The method of claim 1 , wherein the corroding the precursor to form the nanoporous copper comprises first the at least one active metal layer is dissolved to form a plurality of micro-gaps, and then the alloying elements in the copper alloy layer are dissolved to form a plurality of nanopores.

17 . The method of claim 1 , wherein an aperture of the nanoporous copper is about 20 nanometers to about 200 nanometers.

18 . The method of claim 1 , wherein a method of corroding the precursor to form the nanoporous copper comprises placing the precursor in an acidic solution for chemical corroding.

19 . The method of claim 1 , wherein a method of corroding the precursor to form the nanoporous copper comprises: immersing an anode and a cathode in a salt solution, and applying a voltage between the anode and the cathode to dissolve active elements in the precursor, wherein the anode is the precursor, and a material of the cathode is the same as a material of the at least one active metal layer.

Assignees

• Univ Tsinghua
• Hon Hai Prec Ind Co Ltd

Inventors

• Meng yue-feng
• Xiong Lun-Qiao
• Liu Yuan-Feng
• Hou Ze-Cheng
• Fu hong-ying
• Zhu Lin
• Li Wen-Zhen

Classifications

• C22C9/00

  Alloys based on copper · CPC title

• C22C3/00

  Removing material from alloys to produce alloys of different constitution {separation of the constituents of alloys} · CPC title

• C22C9/04

  with zinc as the next major constituent · CPC title

• C22C1/08

  Alloys with open or closed pores · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title