Power conversion device
US-2019131883-A1 · May 2, 2019 · US
Semiconductor module structure
US11222879B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11222879-B2 |
| Application number | US-202016924771-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 9, 2020 |
| Priority date | Jul 24, 2019 |
| Publication date | Jan 11, 2022 |
| Grant date | Jan 11, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A semiconductor module structure includes: a semiconductor element portion including a plurality of capacitor elements; two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and cooling fins, which are conductive, formed on respective surfaces of the bus bars at positions sandwiching the semiconductor element portion. Further, insulating refrigerant is provided in the cooling fins.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor module structure comprising: a semiconductor element portion including a plurality of capacitor elements; two bus bars separate from each other, the two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and a plurality of cooling fins, each of which is conductive, wherein at least one of the plurality of cooling fins is formed on a surface of one of the two bus bars and extends from the surface and in a direction opposite from an other of the two bus bars, and at least one other of the plurality of cooling fins is formed on a surface of the other of the two bus bars, wherein insulating refrigerant is provided in the cooling fins, and wherein the bus bars are formed of an annular member, and a plurality of pairs of the semiconductor element portion and the capacitor elements are arranged along a circumferential direction of the bus bars. 2. The semiconductor module structure according to claim 1 , wherein the semiconductor element portion has a package structure housing semiconductor elements therein, and a space in the package structure is filled with a resin mold.
Assignees
Inventors
Classifications
Interconnections or connectors in packages · CPC title
characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title
- H10W90/00Primary
Package configurations · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Dispositions of multiple die-attach connectors · CPC title
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Frequently asked questions
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- What does patent US11222879B2 cover?
- A semiconductor module structure includes: a semiconductor element portion including a plurality of capacitor elements; two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and cooling fins, which are conductive, formed on respective surfaces of the bus bars at positions sandwiching the semiconductor element portion. F…
- Who is the assignee on this patent?
- Toyota Motor Co Ltd, Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 11 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).