Dual-sided co-packaged optics for high bandwidth networking applications

Patent metadata

Field	Value
Publication number	US-11217573-B2
Application number	US-202016809515-A
Country	US
Kind code	B2
Filing date	Mar 4, 2020
Priority date	Mar 4, 2020
Publication date	Jan 4, 2022
Grant date	Jan 4, 2022

Abstract

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

First claim

What is claimed is:

1. An electronic package, comprising:
a first package substrate;
a second package substrate attached to the first package substrate;
a die attached to the second package substrate; and
a plurality of photonics engines attached to a first surface and a second surface of the first package substrate, wherein the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

2. The electronic package of claim 1 , wherein the die is a switch die.

3. The electronic package of claim 1 , further comprising:
a first socket attached to the first package substrate, wherein the first socket is below the die; and
a plurality of second sockets attached to the first package substrate.

4. The electronic package of claim 3 , wherein individual ones of the second sockets are offset from individual ones of the photonic engine.

5. The electronic package of claim 4 , wherein individual ones of the second sockets are positioned proximate to corners of the first package substrate.

6. The electronic package of claim 3 , wherein the first socket and the plurality of second sockets are a monolithic structure.

7. The electronic package of claim 1 , wherein a first set of the photonic engines on the first surface of the first package substrate comprises four photonic engines, and wherein a second set of photonic engines on the second surface of the package first substrate a comprises four photonic engines.

8. The electronic package of claim 1 , wherein a first set of the photonic engines on the first surface of the first package substrate comprises eight photonic engines, and wherein a second set of photonic engines on the second surface of the package first substrate a comprises eight photonic engines.

9. The electronic package of claim 8 , wherein individual ones of the photonic engines in the first set of photonic engines are positioned directly above individual ones of the photonic engines in the second set of photonic engines.

10. The electronic package of claim 1 , wherein the individual ones of the plurality of photonic engines are attached to the first package substrate by a socket.

11. The electronic package of claim 1 , further comprising:
an integrated heat spreader (IHS) attached to individual ones of the photonic engines.

12. The electronic package of claim 11 , wherein a single IHS is attached to more than one photonic engine.

13. The electronic package of claim 11 , further comprising a plurality of IHSs, wherein individual ones of the plurality of IHSs are attached to a single photonic engine.

14. An electronic package, comprising:
a first package substrate with a first surface and a second surface opposite from the first surface;
a second package substrate attached to the second surface of first package substrate;
a die attached to the second package substrate;
first photonic engines attached to the first surface of the package substrate, wherein the first photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate;
second photonic engines attached to the second surface of the package substrate, wherein the second photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate;
a first socket attached to the first surface of the package substrate, wherein the first socket is within a footprint of the die; and
a plurality of second sockets attached to the first surface of the package substrate, wherein individual ones of the second sockets are outside of the footprints of individual ones of the first photonic engines and the second photonic engines.

15. The electronic package of claim 14 , further comprising:
a plurality of first integrated heat spreaders (IHSs), wherein individual ones of the first IHSs are over individual ones of the first photonic engines; and
a plurality of second IHSs, wherein individual ones of the second IHSs are over individual ones of the second photonic engines.

16. The electronic package of claim 15 , further comprising:
a first heat sink over the first IHSs;
a second heat sink over the second IHSs;
a first retention frame over the first heat sink; and
a second retention frame over the second heat sink.

17. The electronic package of claim 16 , wherein the first heat sink and the second heat sink are liquid cooled plates.

18. The electronic package of claim 17 , wherein the first retention frame and the second retention frame are rings that retain the first photonic engines and the second photonic engines between them.

19. The electronic package of claim 18 , wherein the first socket and the plurality of second sockets extend through the first retention frame.

20. The electronic package of claim 14 , further comprising:
an integrated heat spreader (IHS) over the die; and
a heat sink over the IHS.

21. The electronic package of claim 14 , wherein individual ones of the first photonic engines and individual ones of the second photonic engines are attached to the first package substrate by third sockets.

22. An electronic system, comprising:
a board;
a first package substrate attached to the board by a first socket and a plurality of second sockets, the first package substrate having a first surface facing the board and a second surface facing away from the board;
first photonic engines attached to the first surface of the package substrate by third sockets;
second photonic engines attached to the second surface of the package substrate by third sockets;
a cooling component over the first photonic engines and over the second photonic engines, the cooling component secured against the first photonic engines and the second photonic engines by a first retention frame and a second retention frame;
a second package substrate attached to the second surface of the first package substrate; and
a die attached to the second package substrate, wherein the die is communicatively coupled to individual ones of the first photonic engines and individual ones of the second photonic engines through the first package substrate and the second package substrate.

23. The electronic system of claim 22 , wherein the die is a switching die.

24. The electronic system of claim 23 , wherein the electronic system is a switch blade.

25. The electronic system of claim 24 , wherein the electronic system is a switch blade in a modular server system.

Assignees

• Intel Corp

Inventors

• Pothukuchi Suresh V
• Alduino Andrew
• Mahajan Ravindranath V
• Nekkanty Srikant
• Liao Ling
• Potluri Harinadh
• Bond David M
• Gujjula Sushrutha Reddy
• Tran Donald Tiendung
• Hui David
• Tamarkin Vladimir

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title