Magnetic Tunnel Junction with Low Defect Rate after High Temperature Anneal for Magnetic Device Applications
US-2020395534-A1 · Dec 17, 2020 · US
US11217288B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11217288-B2 |
| Application number | US-201916566472-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2019 |
| Priority date | Mar 18, 2019 |
| Publication date | Jan 4, 2022 |
| Grant date | Jan 4, 2022 |
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According to one embodiment, a magnetic device includes: a first magnetic material provided above a substrate; a second magnetic material provided between the substrate and the first magnetic material; a nonmagnetic material provided between the first magnetic material and the second magnetic material; a first layer provided between the substrate and the second magnetic material and including an amorphous layer; and a second layer provided between the amorphous layer and the second magnetic material and including a crystal layer.
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What is claimed is: 1. A magnetic device comprising: a first magnetic material provided above a substrate; a second magnetic material provided between the substrate and the first magnetic material; a nonmagnetic material provided between the first magnetic material and the second magnetic material; a first layer provided between the substrate and the second magnetic material and including an amorphous layer; a second layer provided between the amorphous layer and the second magnetic material and including a first crystal layer; and a third layer provided between the first layer and the second layer and including a second crystal layer having tantalum. 2. The magnetic device according to claim 1 , wherein the second magnetic material includes a first magnetic layer, a second magnetic layer between the first magnetic layer and the second layer, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer. 3. The magnetic device according to claim 1 , wherein the second magnetic material has an SAF structure. 4. The magnetic device according to claim 1 , wherein the amorphous layer includes a boride layer. 5. The magnetic device according to claim 1 , wherein the first crystal layer includes one of ruthenium, rhodium, palladium, osmium, iridium, and platinum. 6. The magnetic device according to claim 1 , wherein a thickness of the amorphous layer is equal to or thicker than a sum of a thickness of the second layer and a thickness of the crystal third layer. 7. The magnetic device according to claim 1 , wherein a thickness of the second crystal layer is 0.5 nm or more and 2 nm or less. 8. The magnetic device according to claim 1 , wherein a thickness of the first crystal layer is 1 nm or more and 2 nm or less. 9. A memory device comprising: a memory cell including a magnetic device, the magnetic device including: a first magnetic material provided above a substrate; a second magnetic material provided between the substrate and the first magnetic material; a nonmagnetic material provided between the first magnetic material and the second magnetic material; a first layer provided between the substrate and the second magnetic material and including an amorphous layer; a second layer provided between the amorphous layer and the second magnetic material and including a first crystal layer; and a third layer provided between the first layer and the second layer and including a second crystal layer having tantalum; and a control circuit configured to control an operation of the memory cell and provided on the substrate. 10. The memory device according to claim 9 , wherein the second magnetic material includes a first magnetic layer, a second magnetic layer between the first magnetic layer and the second layer, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer. 11. The memory device according to claim 9 , wherein the second magnetic material has an SAF structure. 12. The memory device according to claim 9 , wherein the amorphous layer includes a boride layer. 13. The memory device according to claim 9 , wherein the first crystal layer includes one of ruthenium, rhodium, palladium, osmium, iridium, and platinum. 14. The memory device according to claim 9 , wherein a thickness of the amorphous layer is equal to or thicker than a sum of a thickness of the second layer and a thickness of the third layer. 15. The memory device according to claim 9 , wherein a thickness of the second crystal layer is 0.5 nm or more and 2 nm or less. 16. The memory device according to claim 9 , wherein a thickness of the first crystal layer is 1 nm or more and 2 nm or less. 17. The magnetic device according to claim 1 , wherein: the amorphous layer comprises boride, and the first crystal layer comprises one of platinum and ruthenium. 18. The memory device according to claim 9 , wherein: the amorphous layer comprises boride, and the first crystal layer comprises one of platinum and ruthenium.
Materials of the active region · CPC title
Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer · CPC title
details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title
characterised by the composition of the substrate · CPC title
Exchange coupling of magnetic films via an antiferromagnetic interface (H01F10/3268 takes precedence) · CPC title
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