Method For Mounting An Electrical Component, Wherein A Hood Is Used, And Hood Suitable For Use In Said Method
US-2017117162-A1 · Apr 27, 2017 · US
Electrical assembly
US11212918B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11212918-B2 |
| Application number | US-201816631651-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 19, 2018 |
| Priority date | Jul 18, 2017 |
| Publication date | Dec 28, 2021 |
| Grant date | Dec 28, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electrical assembly comprising: a first wiring support with a first set of electrical contacts disposed on a layer of insulation; an electronic switching element arranged with a first side in contact with the first set of electrical contacts; a second wiring support with a second set of electrical contacts disposed on a layer of insulation, the second wiring support arranged opposite the first wiring support, the second set of electrical contacts in contact with a second side of the electronic switching element; and a force applied across the first wiring support and the second wiring support to compress the electronic switching element therebetween; wherein the layer of insulation for the first wiring support and the second wiring support each comprise a sheet of permanently elastic, electrically insulating, thermally conductive material; and wherein respective contacts between the electronic switching element and the respective sets of electrical contacts do not comprise any mechanical bonds. 2. The electrical assembly as claimed in claim 1 , wherein the electronic switching element comprises a power semiconductor. 3. The electrical assembly as claimed in claim 1 , wherein the permanently elastic material of the first wiring support and/or of the second wiring support is pressed onto a metallic support. 4. The electrical assembly as claimed in claim 3 , wherein the metallic support comprises a cooling element for dissipating heat from the electrical assembly. 5. The electrical assembly as claimed in claim 1 , wherein the permanently elastic material of the first wiring support and/or the second wiring support comprises a polysiloxane and at least one of metal oxide particles or ceramic particles.
Assignees
Inventors
Classifications
Package configurations · CPC title
Die-attach connectors · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Dispositions of multiple die-attach connectors · CPC title
changes in dispositions · CPC title
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Frequently asked questions
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- What does patent US11212918B2 cover?
- Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical…
- Who is the assignee on this patent?
- Siemens Ag
- What technology area does this patent fall under?
- Primary CPC classification H05K1/118. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).