Method and composition for selectively modifying base material surface

US11211246B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11211246-B2
Application numberUS-201916288385-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2019
Priority dateSep 1, 2016
Publication dateDec 28, 2021
Grant dateDec 28, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.

First claim

Opening claim text (preview).

The invention claimed is: 1. A selective modifier composition, comprising: a polymer comprising, at an end of a main chain or a side chain thereof, a group comprising a first functional group capable of forming a bond with silicon; and a solvent, wherein the first functional group is one of a silanol group, a methoxysilyl group, and a hydrosilyl group, and the main chain of the polymer consists of at least one structural unit selected from the group consisting of a structural unit derived from a substituted or unsubstituted styrene, a structural unit derived from a (meth)acrylic acid or a (meth)acrylic acid ester, and a structural unit containing a —Si—O— bond. 2. The selective modifier composition of claim 1 , wherein the polymer has a polystyrene equivalent number average molecular weight of 500 50,000. 3. The selective modifier composition of claim 1 , wherein the first functional group is a silanol group. 4. The selective modifier composition of claim 2 , wherein the first functional group is a silanol group. 5. The selective modifier composition of claim 1 , wherein the main chain of the polymer consists of a structural unit derived from a substituted or unsubstituted styrene. 6. The selective modifier composition of claim 4 , wherein the main chain of the polymer consists of a structural unit derived from a substituted or unsubstituted styrene. 7. The selective modifier composition of claim 1 , wherein the group comprising the first functional group is present at one end of the main chain of the polymer. 8. The selective modifier composition of claim 6 , wherein the group comprising the first functional group is present at one end of the main chain of the polymer. 9. The selective modifier composition of claim 4 , wherein the first functional group is a methoxysilyl group. 10. The selective modifier composition of claim 4 , wherein the first functional group is a methoxysilyl group. 11. A method for selectively modifying a base material surface, the method comprising: applying the selective modifier composition of claim 1 on a surface of a base material such that a coating film is formed on the surface having a first region comprising silicon; and heating the coating film. 12. The method according to claim 11 , wherein the first region comprises a silicon oxide, a silicon nitride, or a silicon oxynitride. 13. The method according to claim 11 , wherein: the base material further comprises a second region that is other than the first region and that comprises a metal; and the method further comprises, after the heating, removing with a rinse agent a portion of the coating film, the portion being formed on the second region. 14. The method according to claim 11 , wherein a polystyrene equivalent number average molecular weight of the polymer is no less than 500 and no greater than 50,000. 15. The method according to claim 11 , wherein the first functional group is a silanol group or a methoxysilyl group. 16. The method according to claim 11 , wherein the main chain of the polymer consists of a structural unit derived from a substituted or unsubstituted styrene. 17. The method according to claim 11 , wherein the polymer comprises at one end of the main chain thereof, the group comprising the first functional group. 18. The method according to claim 13 , further comprising bringing an alcohol, a dilute acid, a hydrogen peroxide solution, ozone or plasma into contact with the surface of the base material after the removing. 19. The method according to claim 13 , further comprising depositing a pattern on the surface of the base material after the removing, with a CVD method or an ALD method. 20. The method according to claim 13 , further comprising etching away the polymer from the surface of the base material after the removing of the portion of the coating film.

Assignees

Inventors

Classifications

  • Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

  • by chemical means · CPC title

  • to change the surface groups of the insulating materials · CPC title

  • In-situ cleaning after layer formation, e.g. removing process residues · CPC title

  • Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11211246B2 cover?
A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain ther…
Who is the assignee on this patent?
Jsr Corp
What technology area does this patent fall under?
Primary CPC classification H10P76/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).