Coil electronic component

US11211194B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11211194-B2
Application numberUS-201816008847-A
CountryUS
Kind codeB2
Filing dateJun 14, 2018
Priority dateOct 16, 2017
Publication dateDec 28, 2021
Grant dateDec 28, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coil electronic component includes a body having a coil portion embedded therein, and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and one or more insulating portions disposed between the plurality of magnetic portions.

First claim

Opening claim text (preview).

What is claimed is: 1. A coil electronic component comprising: a body having a coil portion embedded therein, the coil portion having a magnetic core; and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and an insulating portion disposed between the plurality of magnetic portions, and between the coil portion and the plurality of magnetic portions, wherein the insulating portion is depressed toward the magnetic core. 2. The coil electronic component of claim 1 , wherein the insulating portion is coated on one surface of the magnetic portion. 3. The coil electronic component of claim 2 , wherein the insulating portion is an atomic layer deposition (ALD) layer. 4. The coil electronic component of claim 1 , wherein the insulating portion comprises alumina. 5. The coil electronic component of claim 1 , wherein the insulating portion has a thickness of 100 nm or less. 6. The coil electronic component of claim 1 , wherein the coil portion has a magnetic core formed in a center thereof. 7. The coil electronic component of claim 1 , wherein the insulating portion is in contact with coil patterns included in the coil portion. 8. The coil electronic component of claim 1 , wherein the coil portion includes coating layers formed on surfaces of coil patterns included in the coil portion, and the insulating portion is in contact with the coating layers. 9. The coil electronic component of claim 1 , wherein the insulator is an insulating resin. 10. The coil electronic component of claim 1 , wherein the magnetic particle is formed of an Fe-based alloy. 11. A coil electronic component, comprising: a body comprising magnetic portions and insulating portions disposed between adjacent magnetic portions, the magnetic portions comprising magnetic particles dispersed in an insulator; a coil portion embedded in the body; and external electrodes connected to the coil portion and provided on an external surface of the body, wherein the coil portion has a magnetic core at a center thereof and the insulating portions are depressed toward the magnetic core. 12. The coil electronic component of claim 11 , wherein the insulating portion has a thickness of less than 100 nm and is disposed conformally on a corresponding magnetic portion. 13. The coil electronic component of claim 11 , wherein the insulating portion comprises a ceramic. 14. The coil electronic component of claim 11 , wherein the insulator comprises a resin. 15. The coil electronic component of claim 11 , wherein the magnetic particles comprise a Fe-based alloy. 16. The coil electronic component of claim 11 , wherein the external electrodes comprise a conductive paste disposed on an external surface of the body. 17. A coil electronic component, comprising: a body comprising a plurality of laminates, each laminate comprising a magnetic layer and an insulating layer disposed on the magnetic layer, the laminates being disposed such that the insulating layer and the magnetic layer are alternately stacked; a coil portion embedded in the body and having a magnetic core; and external electrodes disposed on external surfaces of the body and electrically in contact with corresponding ends of the coil portion, wherein the insulating layer of the laminate comprises a ceramic conformally formed on the corresponding magnetic layer, wherein the insulating layer is depressed toward the magnetic core. 18. The coil electronic component of claim 17 , wherein magnetic layer of the laminate comprises magnetic particles dispersed in an insulating material. 19. The coil electronic component of claim 17 , wherein the insulating layer of the laminate has a thickness of less than 100 nm.

Assignees

Inventors

Classifications

  • Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

  • with magnetic core · CPC title

  • with encapsulating core, e.g. made of resin and magnetic powder · CPC title

  • Surface mounted devices · CPC title

  • with stacked layers · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11211194B2 cover?
A coil electronic component includes a body having a coil portion embedded therein, and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and one or more insulating portions disposed between the plurality of magnetic portions.
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01F17/0013. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).