Liquid encapsulation device and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-11209329-B2
Application number	US-201815879964-A
Country	US
Kind code	B2
Filing date	Jan 25, 2018
Priority date	Jan 25, 2018
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A liquid encapsulation device for embedding sensor is provided. The liquid encapsulation device comprises a substrate having an upper surface with a central concave portion; at least one protection layer sealed on the upper surface of the substrate; and at least one sensor fixed on the protection layer. Wherein, the central concave portion is filled with liquid and the sensor is arranged above the central concave portion.

First claim

What is claimed is:

1. A liquid encapsulation device comprising:
a substrate having an upper surface with a central concave portion;
a protection piece sealed on the upper surface of the substrate, wherein the protection piece comprises an upper protection layer and a lower protection layer; and
at least one sensor being used for detecting an epidermal pulse as well as a blood pressure measurement from a blood vessel, the at least one sensor being sandwiched between the upper protection layer and one side of the lower protection layer, the one side facing away from the substrate,
wherein the central concave portion is filled with liquid and the sensor is arranged above the central concave portion, and
wherein the substrate, the upper protection layer and the lower protection layer are made of stretchable flexible materials, and
wherein the liquid in the central concave portion serves as a medium to propagate a pressure wave from the blood vessel to the at least one sensor, to relax a required alignment precision between the at least one sensor and the blood vessel.

2. The device according to claim 1 , wherein the sensor is selected from one member of a group consisting of pressure sensor, strain sensor, displacement sensor, and vibration sensor.

3. The device according to claim 1 , wherein the substrate and the protection piece are made of same stretchable materials.

4. The device according to claim 1 , wherein the substrate and the protection piece are made of different stretchable materials.

5. The device according to claim 1 , wherein the substrate and the protection piece are made of silicone and/or rubber.

6. The device according to claim 1 , further comprising:
an adhesive layer for curing the protection piece onto the upper surface of the substrate.

7. The device according to claim 6 , wherein the adhesive layer is made of uncured silicone.

8. A wearable device, comprising the liquid encapsulation device of claim 1 .

Assignees

• Univ Hong Kong Chinese

Inventors

• Chen Shih-Chi
• Fan Xiangyu
• Zhao Ni
• Huang Yan
• Luo Ningqi

Classifications

• A61B5/02108 Primary

  from analysis of pulse wave characteristics · CPC title

• A61B5/6803

  Head-worn items, e.g. helmets, masks, headphones or goggles · CPC title

• G01L7/182 Primary

  constructional details, e.g. mounting · CPC title

• A61B2562/0247

  Pressure sensors · CPC title

• G01L19/0654

  against moisture or humidity · CPC title