Methods and apparatuses for effluent monitoring for brush conditioning

Patent metadata

Field	Value
Publication number	US-11205582-B2
Application number	US-201916564175-A
Country	US
Kind code	B2
Filing date	Sep 9, 2019
Priority date	May 19, 2017
Publication date	Dec 21, 2021
Grant date	Dec 21, 2021

Abstract

A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.

First claim

What is claimed:

1. A system for monitoring contamination level of effluent of an offline brush conditioning system, the system comprising:
a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush in a first brush station in the offline brush conditioning system;
a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush in a second brush station, wherein the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer; and
an effluent contamination monitor configured to monitor contamination levels of the first effluent from the first set of reservoirs and contamination levels of the second effluent from the second set of reservoirs.

2. The system of claim 1 , further comprising a control system configured to:
control the conditioning of the first brush by comparing the contamination levels of the first effluent in the first set of reservoirs to a first contamination threshold; and
control the conditioning of the second brush by comparing the contamination levels of the second effluent in the second set of reservoirs to a second contamination threshold.

3. The system of claim 2 , the control system is configured to correlate at least one contamination level of the first effluent or the second effluent with time.

4. The system of claim 1 , wherein a material for at least one reservoir of the first set of reservoirs or the second set of reservoirs comprises at least one of quartz, perfluoroalkoxy alkane (PFA), polyvinylidene fluoride (PVDF), or polyethylene terephthalate (PET).

5. The system of claim 1 , wherein the contamination levels comprises at least one of: a liquid particle count, a pH level, or a resistivity.

6. The system of claim 5 , wherein the effluent contamination monitor comprises a liquid particle counter (LPC) configured to measure the liquid particle count.

7. The system of claim 6 , wherein the LPC is configured to use a laser light scattering measurement system.

8. The system of claim 5 , further comprising a control system configured to record to memory at least a portion of the contamination levels of the first effluent and the second effluent in real-time.

9. The system of claim 1 , further comprising a pump system downstream of the first and second sets of reservoirs configured to pump the first and second effluents.

10. The system of claim 1 , further comprising a corresponding brush support for each of the first and second brush stations.

11. The system of claim 10 , wherein at least one brush support is at a fixed angle in the respective brush station.

12. The system of claim 10 , wherein at least one brush support is configured to perform one or both of:
receive a brush for conditioning in one of a plurality of different angles; and
adjust an angle of a brush received for conditioning.

13. A method for monitoring contamination level of effluent of an offline brush conditioning system, the method comprising:
collecting, in a first set of reservoirs, first effluents from corresponding portions of a first brush in a first brush station of the offline brush conditioning system;
collecting, in a second set of reservoirs, second effluents from corresponding portions of a second brush in a second brush station, wherein the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer; and
monitoring, by an effluent contamination monitor, contamination levels of the first effluent from the first set of reservoirs and contamination levels of the second effluent from the second set of reservoirs.

14. The method of claim 13 , further comprising using a control system for:
controlling the conditioning of the first brush by comparing the contamination levels of the first effluent in the first set of reservoirs to a first contamination threshold; and
controlling the conditioning of the second brush by comparing the contamination levels of the second effluent in the second set of reservoirs to a second contamination threshold.

15. The method of claim 13 , wherein each of the first and second brush stations comprises a corresponding brush support.

16. The method of claim 15 , wherein at least one brush support is at a fixed angle in the respective brush station.

17. The method of claim 15 , further comprising performing by at least one brush support one or both of: receiving a brush for conditioning in one of a plurality of different angles; and adjusting an angle of a brush received for conditioning.

18. The method of claim 13 , wherein the contamination levels comprises at least one of: a liquid particle count, a pH level, or a resistivity.

19. The method of claim 13 , further comprising recording to memory at least a portion of the contamination levels of the first effluent and the second effluent in real-time.

20. The method of claim 13 , further comprising a pump system downstream of the first and second sets of reservoirs configured to pump the first and second effluents.

Assignees

• Illinois Tool Works

Inventors

• Withers Bradley Scott
• Hughes Corey Alan
• Nelson Erik Scott
• Christie Steven Kenneth
• Best Brent Allan

Classifications

• H10P90/12

  Preparing bulk and homogeneous wafers · CPC title

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/32

  between different workstations · CPC title