Molding wafer chamber

Patent metadata

Field	Value
Publication number	US-11205579-B2
Application number	US-201715620590-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Aug 11, 2011
Publication date	Dec 21, 2021
Grant date	Dec 21, 2021

Abstract

A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

First claim

What is claimed is:

1. A molding system comprising:
a first chase having one or more vacuum ports in the first chase;
a guiding component mounted in a top surface of the first chase, the guiding component being a plastic ring, the guiding component extending above the top surface of the first chase; and
a second chase having a recess, the recess extending around the guiding component to form a cavity between the first chase and the second chase, wherein a top surface, an inner sidewall, and an outer sidewall of the guiding component are exposed to the cavity.

2. The molding system of claim 1 , wherein the first chase comprises:
a trench in the top surface of the first chase, the trench circling the guiding component.

3. The molding system of claim 2 , wherein a bottom of the trench is level with a bottom of the guiding component.

4. The molding system of claim 1 , wherein the plastic ring comprises a teflon ring.

5. The molding system of claim 1 , wherein an upper surface of the guiding component has a first width, and a bottom surface of the guiding component has a second width greater than the first width.

6. The molding system of claim 1 , wherein the one or more vacuum ports are exposed to the cavity.

7. The molding system of claim 1 , wherein the one or more vacuum ports are disposed in an area of the first chase bounded by the guiding component.

8. The molding system of claim 1 , wherein the guiding component has a first portion and a second portion, the first portion disposed in the top surface of the first chase, the second portion extending above the first portion, wherein a top surface of the first portion is level with the top surface of the first chase.

9. The molding system of claim 8 , wherein a top surface of the first portion is level with the top surface of the first chase, and wherein the top surface of the first portion, a top surface of the second portion, an inner sidewall of the second portion, and an outer sidewall of the second portion are exposed to the cavity.

10. The molding system of claim 9 , wherein an outer sidewall of the first portion is coterminous with the outer sidewall of the second portion, and wherein an inner sidewall of the first portion is spaced apart from an outer sidewall of the cavity further than the inner sidewall of the second portion.

11. A molding system comprising:
a bottom chase having a top surface, the top surface having a first recess;
a plastic ring partially disposed in the first recess of the bottom chase, the plastic ring extending above the top surface of the bottom chase, the plastic ring having an outermost sidewall; and
a top chase disposed over the bottom chase, the top chase having a second recess, wherein a first distance between opposing sidewalls of the second recess of the top chase is greater than a second distance between opposing outermost sidewalls of the plastic ring.

12. The molding system of claim 11 , wherein the plastic ring comprises a teflon ring.

13. The molding system of claim 11 , wherein plastic ring has a first height, and wherein the second recess of the top chase has a second height greater than the first height.

14. The molding system of claim 11 , wherein the bottom chase comprises one or more vacuum ports.

15. The molding system of claim 14 , wherein the bottom chase has a first shape and the top chase has a second shape, wherein the first and second shape together form a cavity, and wherein the vacuum ports are exposed to the cavity.

16. The molding system of claim 11 , further comprising:
a releasing component comprising a plurality of tape rollers adjacent to the top chase.

17. A molding system comprising:
a bottom chase;
a top chase, wherein the bottom chase and the top chase couple together to form a cavity configured to house a molding carrier; and
a plastic ring mounted in the bottom chase, the plastic ring positioned within the cavity to hold the molding carrier, wherein the plastic ring extends above a surface of the bottom chase and extends over a contacting edge between the top chase and the bottom chase, an inner sidewall and an outer sidewall of the plastic ring exposed to the cavity.

18. The molding system of claim 17 , further comprising a trench within the bottom chase outside the plastic ring.

19. The molding system of claim 17 , further comprising:
a releasing component comprising a plurality of tape rollers adjacent to the top chase.

20. The molding system of claim 17 , wherein the plastic ring comprises a teflon ring.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Seminconductor Mfg Company Ltd

Inventors

• Lin Jing-Cheng
• Chang Chin-Chuan
• Hung Jui-Pin
• Lu Szu-Wei
• Jeng Shin-Puu
• Yu Chen-Hua

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/017

  Auxiliary layers for moulds, e.g. release layers or layers preventing residue · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/014 Primary

  using batch processing · CPC title