Antenna module and electronic device comprising the same

Patent metadata

Field	Value
Publication number	US-11201396-B2
Application number	US-201916702948-A
Country	US
Kind code	B2
Filing date	Dec 4, 2019
Priority date	Dec 7, 2018
Publication date	Dec 14, 2021
Grant date	Dec 14, 2021

Abstract

An antenna module comprises a printed circuit board, a communication circuit disposed on a first surface of the printed circuit board, an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes, first conductive elements disposed on the first surface of the printed circuit board, and second conductive elements disposed on a second surface facing the first conductive elements, and a first molding layer covering the first conductive elements.

First claim

What is claimed is:

1. An antenna module comprising:
a printed circuit board;
a communication circuit disposed on a first surface of the printed circuit board;
an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes:
first conductive elements disposed on the first surface of the printed circuit board, and
second conductive elements disposed on a second surface facing the first conductive elements; and

the antenna module further comprising:
a first molding layer covering the first conductive elements, with at least one conductive element of the first conductive elements spaced from remaining conductive elements of the first conductive elements by an interval, and being lower in height than the communication circuit, and
a second molding layer covering the communication circuit,
a metallic compound disposed on the second molding layer,
wherein the first molding layer and the second molding layer comprise epoxy resin,
wherein the first molding layer has a thickness between 100 μm to 170 μm and has a shape, corresponding to a shape of the first conductive elements, of one rectangle or a shape in which two or more rectangles are connected,
wherein the first molding layer is provided such that antennas belonging to the array antenna have a specified characteristic,
wherein, when viewed from above the second surface of the printed circuit board, the first conductive elements are provided to respectively face the second conductive elements,
wherein the array antenna is configured to radiate a beam with a direction, which forms a specified angle with an axis passing through a center of the printed circuit board and facing the second surface from the first surface of the printed circuit board, as a main direction, and
wherein the beam comprises a main lobe, and wherein the main lobe is approximately 45 degrees with the axis.

2. The antenna module of claim 1 , wherein, in the specified characteristic, a gain difference between antennas where the first conductive elements and the second conductive elements are paired is within 0.5 dBi, and a total gain of the array antenna is 8 dBi or greater.

3. An electronic device comprising:
an antenna module; and
a processor electrically connected with the antenna module, and configured to transmit/receive a specified high-frequency signal by using the antenna module,
wherein the antenna module includes:
a printed circuit board;
a communication circuit disposed on a first surface of the printed circuit board;
an array antenna configured to transmit and receive a signal in a frequency band exceeding 3 GHz with the communication circuit based on a command of the processor, wherein the array antenna includes first conductive elements formed on the first surface of the printed circuit board and second conductive elements formed on a second surface of the printed circuit board facing the first conductive elements;
a first molding layer covering the first conductive elements, with at least one conductive element of the first conductive elements spaced from remaining conductive elements of the first conductive elements by an interval, and being lower in height than the communication circuit, and
a second molding layer covering the communication circuit,
a metallic compound disposed on the second molding layer,
wherein the first molding layer and the second molding layer comprise epoxy resin,
wherein the first molding layer has a thickness between 100 μm to 170 μm and has a shape, corresponding to a shape of the first conductive elements, of one rectangle or a shape in which two or more rectangles are connected,
wherein the first molding layer is provided such that antennas belonging to the array antenna have a specified characteristic,
wherein, when viewed from above the second surface of the printed circuit board, the first conductive elements are provided to respectively face the second conductive elements,
wherein the array antenna is configured to radiate a beam with a direction, which forms a specified angle with an axis passing through a center of the printed circuit board and facing the second surface from the first surface of the printed circuit board, as a main direction, and
wherein the beam comprises a main lobe, and wherein the main lobe is approximately 45 degrees with the axis.

4. The electronic device of claim 3 , wherein, in the specified characteristic, a gain difference between antennas where the first conductive elements and the second conductive elements are paired is within 0.5 dBi, and a total gain of the array antenna is 8 dBi or greater.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Jungmin
• Lee Chih Wei
• Seo Chonghwa
• Yoo Sungcheol
• Lee Jongwon

Classifications

• H01Q5/42

  using two or more imbricated arrays (H01Q5/49 takes precedence) · CPC title

• H01Q9/065

  Microstrip dipole antennas (patch antenna H01Q9/0407) · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H01Q21/0025

  Modular arrays · CPC title