Mounting module and antenna apparatus

Patent metadata

Field	Value
Publication number	US-9923261-B2
Application number	US-201614992231-A
Country	US
Kind code	B2
Filing date	Jan 11, 2016
Priority date	Mar 18, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

First claim

What is claimed is:

1. A module, comprising:
a board;
antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal;
an RF circuit unit mounted on a second surface of the board configured for processing the RF signal;
feeding lines connecting the RF circuit unit and the antennas through the board;
a frame disposed on the second surface of the board to enclose the RF circuit unit,
wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas, and an area of the board enclosed by the frame being filled with an epoxy molding compound (EMC) resin for electromagnetic wave shielding.

2. The module of claim 1 , wherein the antennas comprise any one or any combination of a dipole antenna, a monopole antenna, and a patch antenna.

3. The module of claim 2 , wherein when the antennas comprise the patch antenna, the patch antenna is disposed at an intermediate surface portion closer to a center of the first surface than either the dipole antenna or the monopole antenna.

4. The module of claim 1 , further comprising an interlayer antenna disposed in the interior of the board.

5. The module of claim 1 , further comprising a via antenna disposed adjacent to a side surface of the board.

6. The module of claim 5 , wherein the via antenna is perpendicular to the first surface.

7. The module of claim 5 , wherein the via antenna is implemented in consideration of at least one of a frequency, a wavelength, or an interlayer thickness of a Printed Circuit Board (PCB).

8. The module of claim 1 , wherein the antennas comprise a patch antenna disposed between a monopole antenna and a dipole antenna.

9. The module of claim 2 , wherein the RF circuit unit has a width smaller than a width of the board.

10. The module of claim 8 , wherein a horizontal distance between the monopole antenna and the dipole antenna is greater than a width of the RF circuit unit.

11. The module of claim 4 , wherein the interlayer antenna is disposed in a dipole antenna form.

12. The module of claim 1 , wherein the first section is parallel to the first surface and the second section perpendicular the first surface.

13. A module, comprising:
a board;
antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal;
an RF circuit unit mounted on a second surface of the board configured for processing the RF signal; and
feeding lines connecting the RF circuit unit and the antennas through the board,
wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas,
wherein the antennas comprise any one or any combination of a dipole antenna, a monopole antenna, and a patch antenna, and
wherein in response to a number of dipole antennas and monopole antennas exceeding a number of patch antennas, a radiation pattern direction of the RF signal approaches the lateral direction of the mounting module.

14. A module, comprising:
a board;
antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal;
an RF circuit unit mounted on a second surface of the board configured for processing the RF signal;
feeding lines connecting the RF circuit unit and the antennas through the board; and
a via antenna disposed adjacent to a side surface of the board,
wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas, and
wherein the via antenna is disposed in a monopole antenna form in which two vias are connected to each other in series.

Assignees

• Samsung Electro Mech

Inventors

• Jin Se Min
• Kim Min Hoon
• Kim Eun Kyoung
• Jang Seung Goo
• Ji Hyung Geun
• Chang Jae Hyun

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W44/248

  for antennas · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title