High-Frequency Vacuum Electronic Device
US-2019279834-A1 · Sep 12, 2019 · US
US11201028B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11201028-B2 |
| Application number | US-201916589348-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 1, 2019 |
| Priority date | Oct 1, 2019 |
| Publication date | Dec 14, 2021 |
| Grant date | Dec 14, 2021 |
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Traveling-wave tube amplifiers for high-frequency signals, including terahertz signals, and methods for making a slow-wave structure for the traveling-wave tube amplifiers are provided. The slow-wave structures include helical conductors that are self-assembled via the release and relaxation of strained films from a sacrificial growth substrate.
Opening claim text (preview).
What is claimed is: 1. A traveling wave tube amplifier comprising: a slow-wave structure comprising: a cylindrical scaffold comprising a dielectric film, the cylindrical scaffold having an interior surface; and an electrically conductive helix on the interior surface of the cylindrical scaffold, the electrically conductive helix comprising a plurality of electrically conductive strips connected end-to-end; an electron gun positioned to direct one or more beams of electrons axially through the electrically conductive helix or around the periphery of the electrically conductive helix; and an electron collector positioned opposite the electron gun. 2. The amplifier of claim 1 , wherein the cylindrical scaffold comprises silicon nitride, silicon oxide, aluminum oxide, or diamond. 3. The amplifier of claim 1 , wherein the electrically conductive helix has an inner diameter in the range from 1 μm to 50 μm. 4. The amplifier of claim 1 , wherein each electrically conductive strip corresponds to one coil of the electrically conductive helix. 5. The amplifier of claim 1 , further comprising a dielectric support membrane, wherein the slow-wave structure is attached to the dielectric support membrane along the length of the slow-wave structure. 6. The amplifier of claim 5 , wherein the dielectric support membrane comprises diamond or silicon nitride. 7. The amplifier of claim 6 , wherein the electrically conductive helix comprises a material that can be electroplated. 8. The amplifier of claim 7 , wherein the electrically conductive helix comprises gold, copper, nickel, or silver. 9. The amplifier of claim 8 , wherein the cylindrical scaffold comprises silicon nitride, the dielectric support membrane comprises diamond, and the electrically conductive helix comprises gold. 10. The amplifier of claim 8 , wherein the electrically conductive helix has an inner diameter in the range from 1 μm to 50 μm. 11. The amplifier of claim 5 , further comprising a device substrate, wherein the portion of the dielectric support membrane to which the slow-wave structure is attached is suspended over the device substrate. 12. The amplifier of claim 1 , wherein the cylindrical scaffold comprises diamond, has a thickness in the range from 10 nm to 20 nm, and has an inside diameter in the range from 0.5 μm to 2 μm. 13. The amplifier of claim 1 , wherein the cylindrical scaffold comprises silicon nitride, has a thickness in the range from 20 nm to 40 nm, and has an inside diameter in the range from 1 μm to 5 μm. 14. The amplifier of claim 1 , wherein the cylindrical scaffold has an inside diameter in the range from 0.5 μm to 30 μm.
Manufacturing processes or apparatus therefore · CPC title
characterised by the deposition of metallic material · CPC title
Coating on selected surface areas, e.g. using masks · CPC title
of non-emitting electrodes · CPC title
the forward travelling wave being utilised · CPC title
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