Electronic module

Patent metadata

Field	Value
Publication number	US-11189591-B2
Application number	US-201715779679-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 19, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

An electronic module has a first electronic unit having a first substrate 11, a first conductor layer 12 provided on one side of the first substrate 11, and a first electronic element 13 provided on one side of the first conductor layer 12, a first connection body 60 provided on one side of the first electronic element 13, and a second electronic unit having a second electronic element 23 provided on one side of the first connection body 60. The first connection body 60 has a first head part 61 and a plurality of support parts 65 extending from the first head part 61. The electronic module is characterized by that the support part 65 abuts on the first substrate 11 or the first conductor layer 12.

First claim

The invention claimed is:

1. An electronic module comprising:
a first electronic unit having a first substrate, three or more first conductor layers provided on one side of the first substrate, and a first electronic element provided on one side of one of the first conductor layers;
a first connection body provided on one side of the first electronic element; and
a second electronic unit having a second electronic element provided on one side of the first connection body,
wherein the first connection body has a first head part, a first pillar part extending from the first head part to another side and a plurality of support parts extending from the first head part,
the plurality of support parts abut on at least two of the first conductor layers,
the first electronic element has a first terminal on a face on one side,
the second electronic element has a second terminal on a face on the other side,
the first connection body electrically connects the first terminal of the first electronic element and the second terminal of the second electronic element, and
at least one of the first conductor layers, on which the support part abuts, does not perform an electrical function.

2. The electronic module according to claim 1 , wherein
a second connection body is provided on one side of
the second electronic element,
the second connection body has a plurality of extending parts, and
the extending parts and the support parts extend in the same direction with each other in a plan view and do not overlap with each other in the plan view.

3. The electronic module according to claim 1 , wherein
three or more support parts are provided,
at least two first conductor layers, on which the support parts abut, do not perform the electrical function, and at least one first conductor layer, on which the support part abuts, performs an electrical function.

4. The electronic module according to claim 1 , wherein
the first head part has a rectangular shape in a plan view,
the support parts are provided to correspond to three sides or four sides of the first head part.

5. The electronic module according to claim 1 , wherein
the support part extends linearly from a face on the other side of the first head part toward the first substrate or the first conductor layer.

6. The electronic module according to claim 1 , wherein
the first electronic element is exposed from the first head part in a plan view.

7. The electronic module according to claim 1 , wherein
a second connection body is provided on one side of the second electronic element.

8. The electronic module according to claim 7 , wherein
the second connection body has a second head part and a second pillar part extending from the second head part to the other side.

9. An electronic module comprising:
a first electronic unit having a plurality of first substrates which are metal substrates, and a first electronic element provided on one side of one of the plurality of first substrates;
a first connection body provided on one side of the first electronic element; and
a second electronic unit having a second electronic element provided on one side of the first connection body,
wherein the first connection body has a first head part, a first pillar part extending from the first head part to another side and a plurality of support parts extending from the first head part,
the plurality of support parts abut on at least two of the plurality of first substrates which are metal,
the first electronic element has a first terminal on a face on one side,
the second electronic element has a second terminal on a face on the other side,
the first connection body electrically connects the first terminal of the first electronic element and the second terminal of the second electronic element, and
at least one of the plurality of first substrates which are metal, on which the support part abuts, does not perform an electrical function.

Assignees

• Shindengen Electric Mfg

Inventors

• Ikeda Kosuke
• Matsuzaki Osamu

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W72/631

  Shapes of strap connectors · CPC title

• H10W90/811

  Multiple chips on leadframes · CPC title