Multilayered electronic component

Patent metadata

Field	Value
Publication number	US-11183333-B2
Application number	US-202016864653-A
Country	US
Kind code	B2
Filing date	May 1, 2020
Priority date	Dec 31, 2019
Publication date	Nov 23, 2021
Grant date	Nov 23, 2021

Abstract

A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including dielectric layers, and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a resistor disposed on the second surface;
a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other;
a first external electrode disposed on the third surface and connected to the first internal electrode; and
a second external electrode disposed on the fourth surface and connected to the resistor.

2. The multilayer electronic component of claim 1 , wherein the first internal electrode is spaced apart from the fourth surface and is exposed to the third surface, and
the second internal electrode is spaced apart from the third and fourth surfaces.

3. The multilayer electronic component of claim 1 , wherein the first internal electrode has an opening by which the first internal electrode is spaced apart from the via electrode, and
the via electrode is disposed to penetrate through the second internal electrode and the opening.

4. The multilayer electronic component of claim 1 , wherein the via electrode includes two or more via electrodes.

5. The multilayer electronic component of claim 4 , wherein the two or more via electrodes are disposed side by side in the third direction.

6. The multilayer electronic component of claim 1 , wherein the resistor is a fuse.

7. The multilayer electronic component of claim 1 , wherein a first end portion of the resistor in the second direction is connected to the second external electrode, and
a second end portion of the resistor in the second direction is connected to the via electrode.

8. The multilayer electronic component of claim 1 , further comprising:
a cover portion disposed on the resistor,
wherein the cover portion covers a portion of the resistor except for the first end portion of the resistor in the second direction connected to the second external electrode.

9. The multilayer electronic component of claim 8 , wherein the second external electrode extends to cover the first end portion of the resistor, and
the first external electrode extends to cover a portion of the cover portion.

10. The multilayer electronic component of claim 1 , wherein the resistor is a metal glaze.

11. The multilayer electronic component of claim 1 , wherein the first external electrode includes a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion along a portion of the first and second surfaces, and
the second external electrode includes a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion along a portion of the first and second surfaces.

12. The multilayer electronic component of claim 11 , wherein a first end portion of the resistor in the second direction is connected to the second band portion, and
a second end portion of the resistor in the second direction is spaced apart from an end of the first band portion.

13. The multilayer electronic component of claim 1 , wherein a first end portion of the resistor in the second direction is connected to the second external electrode, and
a second end portion of the resistor in the second direction is spaced apart from an end of the first external electrode.

14. The multilayer electronic component of claim 1 , wherein the first external electrode comprises a first electrode layer disposed on the third surface and a first plating layer disposed to cover the first electrode layer, and
the second external electrode comprises a second electrode layer disposed on the fourth surface and a second plating layer disposed to cover the second electrode layer.

Assignees

• Samsung Electro Mech

Inventors

• Cho Won Woo
• Kim Jong Duck
• Won Jae Sun

Classifications

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title