Radiation-sensitive resin composition and electronic component

Patent metadata

Field	Value
Publication number	US-11169440-B2
Application number	US-201816490694-A
Country	US
Kind code	B2
Filing date	Jan 31, 2018
Priority date	Mar 30, 2017
Publication date	Nov 9, 2021
Grant date	Nov 9, 2021

Abstract

A radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

First claim

The invention claimed is:

1. A radiation-sensitive resin composition comprising:
a cycloolefin polymer (A-1) including a protonic polar group;
a cycloolefin polymer (A-2) including a protonic polar group;
a difunctional epoxy compound (B); and
a radiation-sensitive compound (C), wherein
the cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000, and
content of the cycloolefin polymer (A-2) is not less than 5 mass% and not more than 55 mass% of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

2. The radiation-sensitive resin composition according to claim 1 , wherein the difunctional epoxy compound (B) is represented by formula (1), shown below,

where, in formula (1), R 1 is a linear alkylene group having a carbon number of not less than 1 and not more than 15 or a branched alkylene group having a carbon number of not less than 3 and not more than 15, and k is an integer of not less than 1 and not more than 20.

3. The radiation-sensitive resin composition according to claim 1 , wherein content of the difunctional epoxy compound (B) is 150 parts by mass or more per 100 parts by mass of the cycloolefin polymer (A-2).

4. The radiation-sensitive resin composition according to claim 1 , further comprising a compound including at least two alkoxymethyl groups and/or a compound including at least two methylol groups.

5. The radiation-sensitive resin composition according to claim 1 , further comprising a silane coupling agent.

6. The radiation-sensitive resin composition according claim 1 , further comprising an aralkyl phenolic resin.

7. An electronic component having a resin film comprising the radiation-sensitive resin composition according to claim 1 .

Assignees

• Zeon Corp

Inventors

• Fujimura Makoto

Classifications

• C08L2312/08

  by silane · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• C08L61/06

  of aldehydes with phenols · CPC title

• G03F7/0226

  characterised by the non-macromolecular additives · CPC title

• C08G8/10

  with phenol · CPC title