Radiation-sensitive resin composition and electronic device

Patent metadata

Field	Value
Publication number	US-2016202607-A1
Application number	US-201414913489-A
Country	US
Kind code	A1
Filing date	Sep 2, 2014
Priority date	Sep 6, 2013
Publication date	Jul 14, 2016
Grant date	—

Abstract

A radiation-sensitive resin composition containing an alicyclic olefin polymer which has an acidic group (A), a sulfonium salt-based photoacid generator (B) which is represented by the following general formula (1), and a cross-linking agent (C) is provided.

(In the above general formula (1), R 1 , R 2 , and R 3 respectively independently are a C 6 to C 30 aryl group, C 4 to C 30 heterocyclic group, C 1 to C 30 alkyl group, C 2 to C 30 alkenyl group, or C 2 to C 30 alkynyl group, the groups being optionally substituted, and “a” is an integer of 1 to 5.)

First claim

1 . A radiation-sensitive resin composition comprising an alicyclic olefin polymer having an acidic group (A), a sulfonium salt-based photoacid generator (B) represented by the following general formula (1), and a cross-linking agent (C),
wherein, in the general formula (1), R 1 , R 2 , and R 3 respectively independently are a C 6 to C 30 aryl group, C 4 to C 30 heterocyclic group, C 1 to C 30 alkyl group, C 2 to C 30 alkenyl group, or C 2 to C 30 alkynyl group, the groups being optionally substituted, and “a” is an integer of 1 to 5.

2 . The radiation-sensitive resin composition according to claim 1 , wherein in the general formula (1), R 1 , R 2 , and R 3 are C 6 to C 30 aryl groups.

3 . The radiation-sensitive resin composition according to claim 2 , wherein in the general formula (1), R 1 , R 2 , and R 3 are phenyl groups.

4 . The radiation-sensitive resin composition according to claim 1 , wherein in the general formula (1), “a” is 3.

5 . The radiation-sensitive resin composition according to claim 1 , further comprising an antioxidant (D).

6 . The radiation-sensitive resin composition according to claim 1 , wherein a ratio of content of the sulfonium salt-based photoacid generator (B) is 1 to 15 parts by weight with respect to 100 parts by weight of the alicyclic olefin polymer having an acidic group (A).

7 . The radiation-sensitive resin composition according to claim 1 , wherein the cross-linking agent (C) is a compound having two or more epoxy groups.

8 . The radiation-sensitive resin composition according to claim 1 , wherein the cross-linking agent (C) is a compound having two or more oxetanyl groups.

9 . The radiation-sensitive resin composition according to claim 7 , wherein the cross-linking agent (C) is a combination of a compound having two or more epoxy groups and a compound having two or more oxetanyl groups.

10 . An electronic device which is provided with a resin film comprised of a radiation-sensitive resin composition according to claim 1 .

Assignees

• Zeon Corp

Inventors

• Abe Satoshi

Classifications

• G03F7/0045 Primary

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title

• H10H20/852

  Encapsulations · CPC title

• G03F7/004

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• G03F7/038 Primary

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title