Cutting tool

US11167355B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11167355-B2
Application numberUS-201916637038-A
CountryUS
Kind codeB2
Filing dateJul 5, 2019
Priority dateOct 15, 2018
Publication dateNov 9, 2021
Grant dateNov 9, 2021

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A cutting tool includes: a substrate including a rake face; and a coating film that coats the rake face, wherein the coating film includes an α-Al2O3 layer disposed on the substrate, the α-Al2O3 layer includes crystal grains of α-Al2O3, an area ratio of crystal grains oriented in (001) among the crystal grains is 50% to 90% in the α-Al2O3 layer at the rake face, and a film residual stress AA determined based on a crystal plane interval of a (001) plane of the α-Al2O3 layer at the rake face is more than 0 MPa and less than or equal to 2000 MPa, and a film residual stress BA determined based on a crystal plane interval of a (110) plane of the α-Al2O3 layer at the rake face is more than or equal to −1000 MPa and less than 0 MPa.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cutting tool comprising: a substrate including a rake face; and a coating film that coats the rake face, wherein the coating film includes an α-Al 2 O 3 layer disposed on the substrate, the α-Al 2 O 3 layer includes crystal grains of α-Al 2 O 3 , an area ratio of crystal grains oriented in (001) among the crystal grains is more than 50% and less than 90% in the α-Al 2 O 3 layer at the rake face, and in a residual stress measurement performed in accordance with a 2θ-sin 2 ψ method using X rays, a film residual stress A A determined based on a crystal plane interval of a (001) plane of the α-Al 2 O 3 layer at the rake face is more than 0 MPa and less than or equal to 2000 MPa, and a film residual stress B A determined based on a crystal plane interval of a (110) plane of the α-Al 2 O 3 layer at the rake face is more than or equal to −1000 MPa and less than 0 MPa. 2. The cutting tool according to claim 1 , wherein the α-Al 2 O 3 layer has a thickness of more than or equal to 1 μm and less than or equal to 20 μm, in a residual stress measurement performed in accordance with a constant penetration depth method using X rays at a region r 1 interposed between a virtual plane D 1 and a virtual plane D 2 , the virtual plane D 1 being located at a distance d 10 from a surface of the α-Al 2 O 3 layer opposite to the substrate toward the substrate side, the distance d 10 being 10% of the thickness of the α-Al 2 O 3 layer, the virtual plane D 2 being located at a distance d 40 from the surface of the α-Al 2 O 3 layer opposite to the substrate toward the substrate side, the distance d 40 being 40% of the thickness of the α-Al 2 O 3 layer, a residual stress A determined based on the crystal plane interval of the (001) plane of the α-Al 2 O 3 layer at the rake face is more than or equal to −200 MPa and less than or equal to 2000 MPa, and a residual stress B determined based on the crystal plane interval of the (110) plane of the α-Al 2 O 3 layer at the rake face is more than or equal to −1500 MPa and less than or equal to 700 MPa, and a relational expression of A>B is satisfied. 3. The cutting tool according to claim 2 , wherein a stress distribution of the residual stress A has a first a region in which the residual stress A is decreased continuously from the surface of the α-Al 2 O 3 layer opposite to the substrate toward the substrate side, and a second a region which is located at the substrate side relative to the first a region and in which the residual stress A is increased continuously from the surface opposite to the substrate toward the substrate side, and the first a region and the second a region are continuous to each other via a minimum point of the residual stress A. 4. The cutting tool according to claim 2 , wherein a stress distribution of the residual stress B has a first b region in which the residual stress B is decreased continuously from the surface of the α-Al 2 O 3 layer opposite to the substrate toward the substrate side, and a second b region which is located at the substrate side relative to the first b region and in which the residual stress B is increased continuously from the surface opposite to the substrate toward the substrate side, and the first b region and the second b region are continuous to each other via a minimum point of the residual stress B. 5. The cutting tool according to claim 1 , wherein the coating film further includes one or more intermediate layers disposed between the substrate and the α-Al 2 O 3 layer, and each of the intermediate layers includes a compound that is composed of at least one element selected from a group consisting of a group 4 element, a group 5 element, a group 6 element in a periodic table, Al and Si, and at least one element selected from a group consisting of C, N, B, and O.

Assignees

Inventors

Classifications

  • with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer · CPC title

  • coatings specially adapted for cutting tools or wear applications · CPC title

  • characterised by physical features other than shape · CPC title

  • Tools for drilling machines · CPC title

  • B23B27/14Primary

    Cutting tools of which the bits or tips {or cutting inserts} are of special material · CPC title

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What does patent US11167355B2 cover?
A cutting tool includes: a substrate including a rake face; and a coating film that coats the rake face, wherein the coating film includes an α-Al2O3 layer disposed on the substrate, the α-Al2O3 layer includes crystal grains of α-Al2O3, an area ratio of crystal grains oriented in (001) among the crystal grains is 50% to 90% in the α-Al2O3 layer at the rake face, and a film residual stress AA de…
Who is the assignee on this patent?
Sumitomo Electric Hardmetal Corp
What technology area does this patent fall under?
Primary CPC classification B23B27/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).