Substrate assembly and method of bonding substrates

Patent metadata

Field	Value
Publication number	US-11167284-B2
Application number	US-201816172116-A
Country	US
Kind code	B2
Filing date	Oct 26, 2018
Priority date	Nov 1, 2017
Publication date	Nov 9, 2021
Grant date	Nov 9, 2021

Abstract

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

First claim

What is claimed is:

1. A method of bonding substrates, comprising steps of:
providing a first substrate and a second substrate, the first substrate having a first connecting surface, first non-connecting surface opposite to the first connecting surface, and a first peripheral surface interconnecting the first connecting surface to the first non-connecting surface, the second substrate having a second connecting surface and a second peripheral surface extending from the second connecting surface;
subjecting the first connecting surface of the first substrate and the second connecting surface of the second substrate to a surface-modifying treatment, so as to form a first surface-modified region on the first connecting surface and a second surface-modified region on the second connecting surface, the first surface-modified region having a functionality different from those of the first non-connecting surface and the first peripheral surface of the first substrate, the second surface-modified region having a functionality different from that of the second peripheral surface of the second substrate;
contacting the first and second substrates in such a manner that the first connecting surface of the first substrate and the second connecting surface of the second substrate are directly connected with each other through a physical interaction between the first and second surface-modified regions; and
filling a bonding member in a space which is formed between the first substrate and the second substrate that are not subjected to the surface-modifying treatment after the step of contacting the first and second substrates such that the first and second substrates are bonded together.

2. The method as claimed in claim 1 , wherein:
in the step of providing the first and second substrates, the first peripheral surface of the first substrate angularly extends from the first connecting surface to the first non-connecting surface, and the second substrate is formed with a recess, the recess being defined by a recess-defining surface that has the second connecting surface and the second peripheral surface; and
in the step of contacting the first and second substrates, the first substrate is entirely disposed within the recess of the second substrate in such a manner that the first peripheral surface and the recess-defining surface cooperatively define the space.

3. The method as claimed in claim 2 , wherein the first peripheral surface of the first substrate non-perpendicularly extends from the first connecting surface to the first non-connecting surface.

4. The method as claimed in claim 1 , wherein the second substrate further includes a second non-connecting surface opposite to the second connecting surface and the second peripheral surface of the second substrate non-perpendicularly extends from the second connecting surface to the second non-connecting surface, the second peripheral surface and the first connecting surface cooperatively defining the space.

5. The method as claimed in claim 4 , wherein the first substrate includes the first peripheral surface non-perpendicularly extending from the first connecting surface to the first non-connecting surface, the first and second peripheral surfaces intersecting each other to cooperatively define the space.

6. The method as claimed in claim 1 , wherein one of the first and second substrates is formed with a groove serving as the space, the groove being filled with the bonding member.

7. The method as claimed in claim 1 , wherein:
in the step of providing the first and second substrates, one of the first and second substrates is formed with a channel and other one of the first and second substrates is not formed with the channel;
after the first and second substrates are bonded together, the channel is covered by the other one of the first and second substrates that is not formed with the channel to define a microfluidic unit between the first and second substrates.

8. The method as claimed in claim 1 , wherein the bonding member surrounds the first and second surface-modified regions.

9. The method as claimed in claim 1 , wherein the step of filling the bonding member in the space includes the sub-steps of dissolving a portion of the first substrate and a portion of the second substrate that cooperatively define the space using a solvent, and curing the dissolved portions of the first and second substrates to form the bonding member.

10. The method as claimed in claim 9 , wherein the solvent includes ethanol.

Assignees

• Taiwan Green Point Entpr Co

Inventors

• Yang Sung-Yi
• Wang Pao-Chuan

Classifications

• B32B27/302

  comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers · CPC title

• B81B2203/0338

  Channels · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B01L2300/0816

  Cards, e.g. flat sample carriers usually with flow in two horizontal directions · CPC title

• B32B2307/73

  Hydrophobic · CPC title