Tools and systems for processing one or more semiconductor devices, and related methods

Patent metadata

Field	Value
Publication number	US-11164759-B2
Application number	US-201815976623-A
Country	US
Kind code	B2
Filing date	May 10, 2018
Priority date	May 10, 2018
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

A system for fabricating a semiconductor device structure includes a tool comprising a chamber and a platform within the chamber configured to receive a semiconductor device structure thereon. The tool further includes a heating and cooling system in operable communication with the platform and configured to control a temperature of the platform. The heating and cooling system comprises a cooling system including a cold tank for containing a cold thermal transfer fluid, the cold tank configured to be in fluid communication with the platform, thermal transfer fluid supply piping, and thermal transfer fluid return piping, a heating system including a hot tank for containing a hot thermal transfer fluid having a higher temperature than the cold thermal transfer fluid, the hot tank configured to be in fluid communication with the platform, the thermal transfer fluid supply piping, and the thermal transfer fluid return piping, and at least one temporary storage tank configured to receive at least some of the cold thermal transfer fluid or the hot thermal transfer fluid from at least the thermal transfer fluid return piping after switching a thermal load from the platform from one of the cooling system or the heating system to the other of the cooling system or the heating system. Related methods and tools are disclosed.

First claim

What is claimed is:

1. A system for processing one or more semiconductor devices, the system comprising:
a tool comprising:
a chamber; and
a platform within the chamber configured to receive one or more semiconductor devices thereon; and

a heating and cooling system in operable communication with the platform and configured to control a temperature of the platform, the heating and cooling system comprising:
a cooling system including a cold tank configured to hold a cold thermal transfer fluid, the cold tank configured to be in fluid communication with the platform, thermal transfer fluid supply piping, and thermal transfer fluid return piping;
a heating system including a hot tank configured to hold a hot thermal transfer fluid having a higher temperature than the cold thermal transfer fluid, the hot tank configured to be in fluid communication with the platform, the thermal transfer fluid supply piping, and the thermal transfer fluid return piping; and
at least one temporary tank in direct fluid communication with the thermal transfer fluid return piping and configured to receive and store at least some of the cold thermal transfer fluid or the hot thermal transfer fluid directly from at least the thermal transfer fluid return piping for a duration responsive to switching a thermal load of the platform from one of the cooling system or the heating system to the other of the cooling system or the heating system, the thermal transfer fluid return piping comprising a junction, a first portion of the thermal transfer fluid return piping in fluid communication with the cold tank downstream of the junction and a second portion of the thermal transfer fluid return piping in fluid communication with the hot tank downstream of the junction, the at least one temporary tank located downstream of the junction.

2. The system of claim 1 , wherein the at least one temporary tank comprises:
a temporary tank associated with the cooling system configured to be in fluid communication with the thermal transfer fluid return piping and the cold tank; and
another temporary tank associated with the heating system configured to be in fluid communication with the thermal transfer fluid return piping and the hot tank.

3. The system of claim 1 , wherein the at least one temporary tank comprises a single temporary tank configured to be in fluid communication with the thermal transfer fluid return piping and each of the cold tank and the hot tank.

4. The system of claim 1 , further comprising valves to fluidly isolate the at least one temporary tank and the cold tank from the hot tank while the hot thermal transfer fluid is circulated from the hot tank to the platform, from the platform to the thermal transfer fluid return piping, and from the thermal transfer fluid return piping to the hot tank and while the cold thermal transfer fluid is transferred from the at least one temporary tank to the cold tank.

5. The system of claim 1 , further comprising valves to fluidly isolate the at least one temporary tank and the hot tank from the cold tank, the at least one temporary tank configured to release the hot thermal transfer fluid to the hot tank while the cold thermal transfer fluid is circulated from the cold tank to the platform and back to the cold tank.

6. The system of claim 1 , wherein the hot thermal transfer fluid and the cold thermal transfer fluid comprise the same material having different temperatures.

7. The system of claim 1 , wherein the hot thermal transfer fluid is formulated and configured to exhibit a temperature of at least about 70° C. and the cold thermal transfer fluid is formulated and configured to exhibit a temperature of about −70° C. or less.

8. The system of claim 1 , wherein the hot thermal transfer fluid and the cold thermal transfer fluid comprise a fluorocarbon material.

9. The system of claim 1 , further comprising a temperature indicator proximate and in operable communication with a valve configured to place the thermal transfer fluid return piping in fluid communication with the at least one temporary tank responsive to measuring a temperature of the thermal transfer fluid proximate the valve lower than a predetermined temperature while the hot thermal transfer fluid is circulating from the hot tank to the platform.

10. The system of claim 1 , wherein the at least one temporary tank is between the thermal transfer fluid return piping and the cold tank.

11. A method of operating a tool for processing one or more semiconductor devices, the method comprising:
switching a thermal load of a platform of a tool from a cold tank of a heating and cooling system to a hot tank of the heating and cooling system, a cold thermal transfer fluid remaining in thermal transfer fluid return piping between the cold tank and the platform, the cold tank defining a volume configured to hold the cold thermal transfer fluid, the thermal transfer fluid return piping comprising a junction, a first portion of the thermal transfer fluid return piping in fluid communication with the cold tank downstream of the junction and a second portion of the thermal transfer fluid return piping in fluid communication with the hot tank downstream of the junction, each of the cold tank and the hot tank configured to be in fluid communication with the platform;
directing the cold thermal transfer fluid remaining in the thermal transfer fluid return piping to a first temporary tank in fluid communication with the hot tank while directing a hot thermal transfer fluid from the hot tank to the platform and from the platform to the thermal transfer fluid return piping, the hot tank defining a volume configured to hold the hot thermal transfer fluid;
after a duration, directing the hot thermal transfer fluid from the thermal transfer fluid return piping to the hot tank;
switching the thermal load of the platform from the hot tank to the cold tank;
directing the hot thermal transfer fluid remaining in the thermal transfer fluid return piping to a second temporary tank in fluid communication with the cold tank while directing the cold thermal transfer fluid from the cold tank to the platform and from the platform to the thermal transfer fluid return piping with valves configured to directly fluidly couple the thermal transfer fluid return piping with each of the platform, the cold tank, the hot tank, the first temporary tank, and the second temporary tank, each of the first temporary tank and the second temporary tank located downstream of the junction; and
after a duration, directing the cold thermal transfer fluid from the thermal transfer fluid return piping to the cold tank.

12. The method of claim 11 , further comprising repeating switching the thermal load of the platform from the cold tank to the hot tank, directing the cold thermal transfer fluid remaining in the thermal transfer fluid return piping to the first temporary tank in fluid communication with the hot tank while directing a hot thermal transfer fluid from the hot tank to the platform and from the platform to the thermal transfer fluid return piping, directing the hot thermal transfer fluid from the thermal transfer fluid return piping to the hot tank, and switching the thermal load of the platform from the hot tank to the cold tank.

13. The method of claim 11 , wherein the platform comprises an electrostatic chuck and further comprising patterning a semiconductor wafer on the electrostatic chuck while switching the thermal load of the electrostatic chuck from the cold tank to the hot tank and while switching the thermal load of the electrostatic chuck from the hot tank to the cold tank.

14. The method of claim

Assignees

• Micron Technology Inc

Inventors

• Koltonski Michael E

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10P72/0421 Primary

  for drying etching · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0434

  mainly by convection · CPC title