Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained thereby

Patent metadata

Field	Value
Publication number	US-9708174-B2
Application number	US-201414341458-A
Country	US
Kind code	B2
Filing date	Jul 25, 2014
Priority date	Jul 31, 2013
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.

First claim

The invention claimed is:

1. A packaged device comprising:
a support;
a first die coupled to the support, the first die having a sensitive region;
a packaging mass of moldable material coupled to the support and surrounding the die, the packaging mass embedding a portion of the first die;
a barrier layer abutting the packaging mass;
sealing regions separated from the packaging mass by the barrier layer, electrical connection wires embedded in the sealing regions; and
a chamber located between the packaging mass and the sensitive region, a surface of the barrier layer in the chamber facing a portion of the sensitive region, the chamber being in fluid communication with an environment outside of the packaged device, an inner surface of the packaging mass being exposed in the chamber.

2. The packaged device according to claim 1 , wherein the chamber is in fluid communication with the environment outside of the packaged device through a hole extending through the packaging mass.

3. The packaged device according to claim 1 , wherein the first die comprises a body of semiconductor material having a main face and side surfaces, the sensitive area faces the main face of the body, the chamber faces the main face, and the packaging mass surrounds sealing regions at side surfaces of the body.

4. The packaged device according to claim 1 , wherein the first die comprises a body of semiconductor material having a main face and side surfaces, the sensitive region faces the main face of the body, and the chamber covers the sensitive region.

5. The packaged device according to claim 4 , comprising a second die housed within the chamber.

6. The packaged device according to claim 5 , wherein the second die is located between the support and the first die.

7. The packaged device according to claim 1 , further comprising a second die and electrical connection wires having a first end coupled to the first die and a second end coupled to one of the support and the second die, the electrical connection wires being embedded in sealing regions.

8. The packaged device according to claim 1 , further includes a barrier layer facing the chamber, wherein the chamber is formed in part by a lateral delimitation wall of the barrier layer.

9. The packaged device according to claim 8 , wherein the barrier layer is a polymer or conductive ink.

10. The packaged device according to claim 1 , wherein the packaged device is one of a pressure sensor, a microphone, a humidity sensor, a gas sensor, and a chemical sensor.

11. An electronic device, comprising:
a microprocessor;
a packaged device coupled to the microprocessor, the packaged device including:
a support;
a first die coupled to the support, the first die having a first surface including a sensitive region and side surfaces;
connection wires coupling the first die to the support;
a sealing region, the connection wires embedded in the sealing region;
molded resin coupled to the support and surrounding the first and side surfaces of the first die, the molded resin including an access port;
a conductive layer between the packaging mass and the sealing region; and
a chamber located between the molded resin and the sensitive region, the chamber in fluid communication with an environment outside of the packaged device by the access port of the packaging mass.

12. The electronic device according to claim 11 , wherein the packaged device further includes a barrier layer between the packaging mass and the chamber.

13. The electronic device according to claim 11 , wherein the packaged device further comprising a second die including an integrated circuit between the first die and the support.

14. The electronic device according to claim 11 , wherein the electronic device is at least one of a cell phone, personal digital assistant (PDA), wearable device, voice recorder, and alarm.

15. A packaged device comprising:
a support;
a first die coupled to the support, the first die having a sensitive region at a first surface, the first die coupled to the support by connection wires;
a packaging mass of moldable material coupled to the support and covering the first die;
sealing regions, the connection wires embedded in the sealing regions;
a barrier layer between the packaging mass and the sealing regions;
the packaging mass having a through hole;
a chamber located between the packaging mass and the sensitive region, the chamber being in fluid communication with an environment outside of the packaged device by the through hole of the packaging mass; and
a second die and electrical connection wires having a first end coupled to the first die and a second end coupled to one of the support and the second die.

16. The packaged device according to claim 15 , wherein the chamber is formed in part by a lateral delimitation wall of the barrier layer.

17. The packaged device according to claim 15 , wherein the barrier layer is a polymer or conductive ink.

18. The packaged device according to claim 15 , wherein the packaged device is one of a pressure sensor, a microphone, a humidity sensor, a gas sensor, and a chemical sensor.

19. The packaged device according claim 15 , wherein the sealing regions and the packaging mass are different materials.

20. A packaged device comprising:
a support;
a first die coupled to the support, the first die having a sensitive region;
electrical connection wires electrically coupling the first die to the support;
sealing regions, the electrical connection wires embedded in the sealing regions;
a conductive layer covering the sealing regions;
a packaging mass of moldable material coupled to the support and covering a portion of the die and the conductive layer;
a chamber located between the packaging mass and the sensitive region, the packaging mass covering the chamber and a portion of the sensitive region on the first die; and
a hole extending though the packaging mass and placing the chamber in fluid communication with an environment outside of the packaged device, a surface of the packaging mass defining the hole.

21. The packaged device according to claim 20 , wherein the first die comprises a body of semiconductor material having a main face and side surfaces, the sensitive area faces the main face of the body, the chamber faces the main face, and the sealing regions surround side surfaces of the body.

22. The packaged device according to claim 20 , wherein the conductive layer is a polymer or conductive ink.

23. The packaged device according to claim 20 , wherein the packaged device is one of a pressure sensor, a microphone, a humidity sensor, a gas sensor, and a chemical sensor.

24. The packaged device according to claim 20 , wherein the conductive layer is a barrier layer between the packaging mass and the chamber.

25. The packaged device of claim 24 , further comprising a surface of the barrier layer defining the hole, the surface of the packaging mass having a first edge and the surface of the barrier layer having a second edge, the first edge and the second edge being coincident.

Assignees

• St Microelectronics Srl

Inventors

• Ziglioli Federico Giovanni

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title