Method for dressing polishing pads

Patent metadata

Field	Value
Publication number	US-11148250-B2
Application number	US-201614994202-A
Country	US
Kind code	B2
Filing date	Jan 13, 2016
Priority date	Jan 14, 2015
Publication date	Oct 19, 2021
Grant date	Oct 19, 2021

Abstract

A method dresses one polishing cloth or two polishing pads simultaneously, in which a polishing cloth has been applied to a polishing plate, with at least one dresser (4), which is equipped with at least one dressing element (8), this at least one dressing element (8) being in contact with the at least one polishing cloth (11, 12) to be dressed, wherein the at least one polishing plate (21, 22) is rotated with a relative rotational speed and the at least one dresser (4) is rotated with a relative rotational speed and at least two different combinations of directions of rotation of the two pairs of polishing plates (21, 22) and pin wheels (31, 32) are executed during the simultaneous dressing of two polishing pads (11, 12) or during the dressing of one polishing cloth (11) of the polishing plate (21) and of the at least one dresser (4).

First claim

The invention claimed is:

1. A method for conducting a multidirectional dressing process on a polishing cloth, the polishing cloth being applied to a polishing, the method for conducting the dressing process on the polishing cloth comprising:
disposing at least one pin wheel at a periphery of the polishing plate to allow different relative rotation directions of the dresser and polishing plate;
arranging at least one dresser, including a dressing element disposed on a first side of the at least one dresser, such that the polishing cloth is in a state where the polishing cloth is in contact with the dressing element, the polishing cloth being between the polishing plate and the first side of the dresser;
in the state where the polishing cloth is in contact with the dressing element, performing a multi-phased dressing operation creating directionally independent asperities on the polishing cloth, the multi-phased dressing operations comprising:
in a first phase:
rotating the polishing plate in a first direction with a first relative rotational speed, the rotating of the polishing plate resulting in a rotation of the polishing cloth in the first direction with the first relative rotational speed; and
rotating the at least one dresser in a second direction with a second relative rotational speed, wherein the second direction is opposite the first direction and where the second relative rotational speed differs from the first relative rotational speed so as to dress the polishing cloth in the first phase; and

in a second phase of the multidirectional dressing process, after the first phase:
rotating the polishing plate in the second direction, which reverses the rotation of the polishing cloth to also be in the second direction;
and rotating the at least one dresser in the first direction so as to dress the polishing cloth in the second phase creating directionally independent asperities.

2. The method of claim 1 , further comprising:
rotating the dresser using a rolling device including an inner gear wheel and an outer gear wheel.

3. The method of claim 2 , further comprising:
setting mutually facing faces of an upper polishing plate and a lower polishing plate plane-parallel to one another.

4. The method of claim 2 , wherein the dresser has a clearance, and the dressing element is freely movable or fixed in the clearance.

5. The method of claim 1 , wherein disks or rings covered with one or more dressing elements, comprising the dressing element, are used as the dresser.

6. The method of claim 1 , wherein the dressing element includes a surface covered with diamonds.

7. The method of claim 1 , wherein the at least one dresser is one of one to five dressers that are used simultaneously.

8. The method of claim 1 , wherein the at least one dresser is one of at least three dressers that are used simultaneously.

9. The method of claim 1 , wherein the polishing cloth is a foamed polishing pad.

10. The method of claim 9 , wherein the foamed polishing pad is a foamed polyurethane.

11. The method of claim 1 , further comprising:
applying a dressing agent to the polishing cloth.

12. The method of claim 1 , further comprising:
applying a liquid dressing agent to the polishing cloth.

13. The method of claim 1 , wherein a second polishing cloth is applied to a second polishing plate, wherein a second dressing element is on a second side of the dresser, the method further comprising:
contacting the second polishing cloth with the second dressing element, the second polishing cloth being disposed between the second polishing plate and the second side of the dresser; and
in a state where the second polishing cloth is in contact with the second dressing element, rotating the second polishing plate simultaneously with the polishing plate in the first direction with the first relative speed.

14. The method of claim 1 ,
wherein the method is performed by a polishing device that is configured to polish the semiconductor wafer, the polishing device comprising the polishing plate and configured to receive the dresser and the pin wheel, and
wherein the method further comprises:
prior to polishing the semiconductor wafer, removing the pin wheel and disposing the semiconductor wafer in the polishing device.

15. The method of claim 14 , the method further comprising, prior to disposing the semiconductor wafer in the polishing device, disposing a carrier plate in the polishing device, wherein the semiconductor wafer is disposed in the carrier plate.

16. The method of claim 14 , of the method comprising removing the dresser after performing a plurality of dressing operations creating the directionally independent asperities on the polishing cloth.

17. The method according to claim 1 , wherein the plurality of multi-phased dressing operation further comprises a third phase, during which the direction of rotation is reversed for at least one of the polishing plate or the at least one dresser while the polishing cloth maintains the state of contact with the at least one dresser.

18. The method according to claim 17 ,
wherein the first direction is a clockwise direction and the second direction is a counter clockwise direction,
wherein the multi-phased dressing operation further comprises a fourth phase, during which the direction of rotation is reversed for at least one of the polishing plate or the at least one dresser while the polishing cloth maintains the state of contact with the at least one dresser, and
wherein upon completing all of the first phase, the second phase, the third phase, and the fourth phase, each of the following combinations of directions of rotation of the polishing plate and the at least one dresser have been performed:
the polishing plate and the at least one dresser rotating in the clockwise direction;
the polishing plate and the at least one dresser rotating in the counter clockwise direction;
the polishing plate rotating in the clockwise direction and the at least one dresser rotating the counter clockwise direction; and
the polishing plate rotating in the counter clockwise direction and the at least one dressing rotating in the clockwise direction.

Assignees

• Siltronic Ag

Inventors

• Dutschke Vladimir
• Olbrich Torsten
• Mistur Leszek
• Schnappauf Markus

Classifications

• B24B49/18

  taking regard of the presence of dressing tools · CPC title

• B24B53/12

  Dressing tools; Holders therefor · CPC title

• B24B53/003

  using at least two conditioning tools · CPC title

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title