Pluggable LGA socket for high density interconnects

Patent metadata

Field	Value
Publication number	US-11146003-B2
Application number	US-201816108350-A
Country	US
Kind code	B2
Filing date	Aug 22, 2018
Priority date	Oct 22, 2014
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.

First claim

What is claimed is:

1. A method comprising:
inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package;
inserting a first conductive wedge into the opening of the channel housing and above the electrical-to-optical transceiver, wherein a tapered opening remains in the channel housing after the first conductive wedge and the electrical-to-optical transceiver are inserted into the channel housing, wherein a gap of the tapered opening decreases progressively starting from the opening; and
inserting a second conductive wedge into the gap of the tapered opening.

2. The method of claim 1 , wherein a first end of a retention clip is coupled to a side of the channel housing that is opposite the tapered opening, wherein the retention clip runs along a top of the channel housing, wherein the method comprises:
moving the retention clip into a position to secure at least one of the first conductive wedge or the second conductive wedge into the opening of the channel housing.

3. The method of claim 1 , further comprising:
positioning a conductive lid on top of the electrical-to-optical transceiver, wherein the first conductive wedge and the second conductive wedge are inserted above the conductive lid.

4. The method of claim 3 , wherein the conductive lid comprises at least one lid extension.

5. The method of claim 4 , wherein the channel housing comprises a channel housing rail that includes at least one slot, wherein positioning the conductive lid on top of the electrical-to-optical transceiver comprises placing the at least one lid extension in the at least one slot.

6. The method of claim 1 , wherein an alignment hole is vertically aligned in the channel housing and an engage button is positioned on top of the second conductive wedge.

7. The method of claim 6 , wherein inserting the second conductive wedge into the gap of the tapered opening comprises placing the engage button in the alignment hole.

8. The method of claim 1 , wherein the second conductive wedge causes a downward force to be applied to the electrical-to-optical transceiver, wherein the downward force provides electrical connection between the electrical-to-optical transceiver and the land grid array connector.

9. The method of claim 1 , wherein the second conductive wedge, when inserted in the channel housing, provides a thermal heat dissipation path away from the electrical-to-optical transceiver.

10. An apparatus comprising:
a land grid array connector positioned above an electrical package;
a channel housing positioned above the land grid array connector;
an electrical-to-optical transceiver positioned in an opening of the channel housing; a first conductive wedge for inserting into the opening of the channel housing and above the electrical-to-optical transceiver, wherein a tapered opening remains in the channel housing after the first conductive wedge and the electrical-to-optical transceiver are inserted into the channel housing,
wherein a gap of the tapered opening decreases progressively starting from the opening; and
a second conductive wedge for inserting into the gap of the tapered opening.

11. The apparatus of claim 10 , further comprising:
a retention clip, wherein a first end of the retention clip is coupled to a side of the channel housing that is opposite the tapered opening, wherein the retention clip runs along a top of the channel housing.

12. The apparatus of claim 10 , further comprising a conductive lid positioned above the electrical-to-optical transceiver and below the first conductive wedge.

13. The apparatus of claim 12 , wherein the conductive lid comprises at least one lid extension.

14. The apparatus of claim 13 , wherein the channel housing comprises a channel housing rail that includes at least one slot, wherein the at least one lid extension is placed in the at least one slot.

15. The apparatus of claim 10 , wherein an alignment hole is vertically aligned in the channel housing and an engage button is positioned on top of the second conductive wedge.

16. The apparatus of claim 10 , wherein the channel housing comprises attachment railings to secure the channel housing to the electrical package.

17. The apparatus of claim 10 , wherein the second conductive wedge causes a downward force to be applied to the electrical-to-optical transceiver, wherein the downward force provides electrical connection between the electrical-to-optical transceiver and the land grid array connector.

18. The apparatus of claim 10 , and wherein the second conductive wedge, when inserted in the channel housing, provides a thermal heat dissipation path away from the electrical-to-optical transceiver.

Assignees

• IBM

Inventors

• Benner Alan F
• Fasano Benjamin Vito
• Fortier Paul Francis
• Toy Hilton T

Classifications

• H01R4/5083 Primary

  using a wedge · CPC title

• H01R12/523

  by an interconnection through aligned holes in the boards or multilayer board · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H01R12/772

  Strain relieving means · CPC title

• H01R12/79

  connecting to rigid printed circuits or like structures · CPC title