Pluggable lga socket for high density interconnects

Patent metadata

Field	Value
Publication number	US-2016118731-A1
Application number	US-201414520530-A
Country	US
Kind code	A1
Filing date	Oct 22, 2014
Priority date	Oct 22, 2014
Publication date	Apr 28, 2016
Grant date	—

Abstract

In some embodiments, an apparatus includes a land grid array connector positioned above an electrical package. The apparatus also includes a channel housing positioned above the land grid array. The apparatus includes an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing. A gap of the tapered opening decreases progressively starting from the opening of the socket. A conductive wedge positioned in the gap of the tapered opening.

First claim

1 .- 14 . (canceled)

15 . An apparatus comprising:
a land grid array connector positioned above an electrical package; a channel housing positioned above the land grid array; an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing, wherein a gap of the tapered opening decreases progressively starting from the opening of the socket; and a conductive wedge positioned in the gap of the tapered opening.

16 . The apparatus of claim 15 , further comprising a conductive lid positioned above the electrical-to-optical transceiver and below the conductive wedge.

17 . The apparatus of claim 16 , wherein the conductive lid comprises at least one lid extension.

18 . The apparatus of claim 17 , wherein the channel housing comprises a channel housing rail that includes at least one slot, wherein the at least one lid extension is placed in the at least one slot.

19 . The apparatus of claim 15 , wherein an alignment hole is vertically aligned in the channel housing and an engage button is positioned on top of the conductive wedge.

20 . The apparatus of claim 15 , wherein the channel housing comprises attachment railings to secure the channel housing to the electrical package.

Assignees

• IBM

Inventors

• Benner Alan F
• Fasano Benjamin Vito
• Fortier Paul Francis
• Toy Hilton T

Classifications

• H01R43/205

  with a panel or printed circuit board · CPC title

• H01R24/76

  with sockets, clips or analogous contacts and secured to apparatus or structure, e.g. to a wall · CPC title

• H01R12/7076 Primary

  for connection between PCB and component, e.g. display · CPC title

• H01R12/71

  for rigid printing circuits or like structures · CPC title

• H01R4/5083 Primary

  using a wedge · CPC title