Electrostatic chuck and plasma processing apparatus
US-10825660-B2 · Nov 3, 2020 · US
US11145532B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11145532-B2 |
| Application number | US-201916722789-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2019 |
| Priority date | Dec 21, 2018 |
| Publication date | Oct 12, 2021 |
| Grant date | Oct 12, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.
Opening claim text (preview).
What is claimed is: 1. An electrostatic chuck, comprising: a base plate; and a ceramic dielectric substrate having a substantially circular planar configuration, being provided on the base plate, and having a first major surface exposed externally, the first major surface including at least a first region, and a second region adjacent to the first region, the first region having a plurality of first grooves, at least one first gas introduction hole, and at least one second groove provided in the first region, the at least one first gas introduction hole being connected to at least one of the plurality of first grooves, the at least one second groove extending in a direction crossing the plurality of first grooves, the plurality of first grooves having substantially circular planar configurations and being provided concentrically, the second groove being connected to at least two of the first grooves, wherein, when projected onto a plane perpendicular to a first direction, at least a portion of the first gas introduction hole overlaps both of the first groove and the second groove at a portion where the first groove and the second groove are connected, the first direction being from the base plate toward the ceramic dielectric substrate, the first region has a first boundary groove at an edge portion thereof proximate the second region, the second region has a second boundary groove at an edge portion thereof proximate the first region, and the first and second boundary grooves are spaced closer together than other, adjacent grooves of the plurality of first grooves. 2. The chuck according to claim 1 , wherein at least two of the second grooves are provided in the first region. 3. The chuck according to claim 1 , wherein the second region further has a plurality of third grooves provided in the second region, the second region further has at least one second gas introduction hole connected to at least one of the plurality of third grooves, the second region further has at least one fourth groove connected to at least two of the third grooves, the at least one fourth groove extending in a direction crossing the plurality of third grooves, the plurality of third grooves has substantially circular planar configurations and is provided concentrically with a center of the plurality of first grooves as a center, and when projected onto the plane perpendicular to the first direction, at least a portion of the second gas introduction hole overlaps at least one of the third groove or the fourth groove at a portion where the third groove and the fourth groove are connected. 4. The chuck according to claim 3 , wherein at least two of the fourth grooves are provided in the second region. 5. The chuck according to claim 3 , wherein the second region is provided outward of the first region with respect to a center of the first major surface, and when projected onto the plane perpendicular to the first direction, at least a portion of the first gas introduction hole overlaps at least one of the second groove or an outermost first groove among the first grooves in the first region at a portion where the second groove and the outermost first groove are connected, and at least a portion of the second gas introduction hole overlaps at least one of the fourth groove or an innermost third groove among the third grooves in the second region at a portion where the fourth groove and the innermost third groove are connected. 6. The chuck according to claim 3 , wherein an angle between a first boundary and a line connecting a center of the first gas introduction hole and a center of the second gas introduction hole is less than 90°, the first boundary being between the first region and the second region. 7. The chuck according to claim 3 , wherein an angle between a first boundary and a line connecting a center of the first gas introduction hole and a center of the second gas introduction hole is 90°, the first boundary being between the first region and the second region. 8. The chuck according to claim 7 , wherein the first region has a lift pin hole provided in the first region, and a distance between the lift pin hole and the outermost first groove is greater than a distance between the lift pin hole and the first groove most proximal to the lift pin hole among the plurality of first grooves other than the outermost first groove. 9. The chuck according to claim 1 , wherein the ceramic dielectric substrate has a plurality of spaced-apart raised dots extending upwardly from the first major surface and configured to support a workpiece thereon at a level above the first major surface. 10. An electrostatic chuck, comprising: a base plate; and a ceramic dielectric substrate having a substantially circular planar configuration, being provided on the base plate, and having a first major surface exposed externally, the first major surface including at least a first region, and a second region adjacent to the first region, the first region having a plurality of first grooves, at least one first gas introduction hole, and at least one second groove provided in the first region, the at least one first gas introduction hole being connected to at least one of the plurality of first grooves, the at least one second groove extending in a direction crossing the plurality of first grooves, the plurality of first grooves having substantially circular planar configurations and being provided concentrically, the second groove being connected to at least two of the first grooves, wherein: at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected, the first region has a first boundary groove at an edge portion thereof proximate the second region, the second region has a second boundary groove at an edge portion thereof proximate the first region, and the first and second boundary grooves are spaced closer together than other, adjacent grooves of the plurality of first grooves. 11. An electrostatic chuck, comprising: a base plate; and a ceramic dielectric substrate having a substantially circular planar configuration, being provided on the base plate, the ceramic dielectric substrate having a first major surface exposed externally, and having a plurality of spaced-apart raised dots extending upwardly from the first major surface and configured to support a workpiece thereon at a level above the first major surface, the first major surface including at least a first region, and a second region adjacent to the first region, the first region having a plurality of first grooves, at least one first gas introduction hole, and at least one second groove provided in the first region, the at least one first gas introduction hole being connected to at least one of the plurality of first grooves, the at least one second groove extending in a direction crossing the plurality of first grooves, the plurality of first grooves having substantially circular planar configurations and being provided concentrically, the second groove being connected to at least two of the first grooves, wherein at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected, the first region has a first boundary groove at an edge portion thereof proximate the second region, the second region has a second boundary groove at an edge portion thereof proximate the first region, and the first and second boundary grooves are spaced closer together than other, adjacent grooves of the plurality of
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
characterised by lifting arrangements, e.g. lift pins · CPC title
Details of electrostatic chucks · CPC title
characterised by the mechanical construction of the susceptor, stage or support · CPC title
characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.