Ultrasonic bonding apparatus and ultrasonic bonding method using the same

Patent metadata

Field	Value
Publication number	US-11135779-B2
Application number	US-202016886993-A
Country	US
Kind code	B2
Filing date	May 29, 2020
Priority date	Sep 30, 2019
Publication date	Oct 5, 2021
Grant date	Oct 5, 2021

Abstract

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

First claim

What is claimed is:

1. An ultrasonic bonding apparatus comprising:
a stage on which a display panel is seated;
a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provides a first polarization; and
a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction which is crossed with the first direction, and provides a second polarization,
wherein a third polarization is provided on a plane on which the display panel contacts the electronic component.

2. The ultrasonic bonding apparatus of claim 1 , further comprising:
a pressurization unit disposed over the second ultrasonic generation unit.

3. The ultrasonic bonding apparatus of claim 1 , wherein the third polarization is a synthesis wave of the first polarization and the second polarization.

4. The ultrasonic bonding apparatus of claim 1 , wherein the third polarization has a frequency about 40 kilohertz to about 60 kilohertz.

5. The ultrasonic bonding apparatus of claim 1 , wherein the first polarization and the second polarization have a prescribed phase difference.

6. The ultrasonic bonding apparatus of claim 5 , wherein the third polarization is a circular polarization.

7. The ultrasonic bonding apparatus of claim 5 , wherein the third polarization is an elliptical polarization.

8. The ultrasonic bonding apparatus of claim 1 , wherein the first polarization and the second polarization have an identical phase.

9. The ultrasonic bonding apparatus of claim 8 , wherein the third polarization is a linear polarization.

10. The ultrasonic bonding apparatus of claim 1 , wherein the first polarization and the second polarization have an identical amplitude.

11. The ultrasonic bonding apparatus of claim 1 , wherein the first ultrasonic generation unit and the second ultrasonic generation unit vibrate at a substantially same time.

12. An ultrasonic bonding method, the method comprising:
bringing a display panel, which is seated on a stage connected to a first ultrasonic generation unit, into contact with an electronic component seated in a second ultrasonic generation unit;
providing a first polarization vibrating in a first direction from the first ultrasonic generation unit;
providing a second polarization vibrating in a second direction, which crosses with the first direction, from the second ultrasonic generation unit; and
joining the display panel to the electronic component by a third polarization provided on a plane on which the display panel contacts the electronic component.

13. The ultrasonic bonding method of claim 12 , wherein the third polarization is a synthesis wave of the first polarization and the second polarization.

14. The ultrasonic bonding method of claim 12 , further comprising:
applying, by a pressurization unit disposed over the second ultrasonic generation unit, pressure in a third direction which crosses with the first direction and the second direction.

15. The ultrasonic bonding method of claim 12 , where the providing the first polarization and the providing the second polarization proceed at a substantially same time.

16. The ultrasonic bonding method of claim 12 , wherein the display panel comprises a plurality of signal pads, the electronic component comprises a plurality of driving bumps, and identical energy is applied to each of planes on which the plurality of signal pads contacts the plurality of driving bumps.

17. The ultrasonic bonding method of claim 12 , wherein the third polarization has a frequency of about 40 kilohertz to about 60 kilohertz.

18. The ultrasonic bonding method of claim 12 , wherein the third polarization is an elliptical polarization.

19. The ultrasonic bonding method of claim 12 , wherein the third polarization is a linear polarization.

20. The ultrasonic bonding method of claim 12 , wherein the third polarization is a circular polarization.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Hyun A
• Park Chan-Jae
• Woo Heeju
• Youk Kikyung
• Lee Sangduk
• Jang Daehwan

Classifications

• G02F1/1345

  Conductors connecting electrodes to cell terminals · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K3/328 Primary

  by welding · CPC title

• H05K2201/05

  Flexible printed circuits [FPCs] · CPC title

• B29C65/088

  using several cooperating sonotrodes, i.e. interacting with each other, e.g. for realising the same joint · CPC title