Method to selectively pattern a surface for plasma resistant coat applications

US11124659B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11124659-B2
Application numberUS-201815883787-A
CountryUS
Kind codeB2
Filing dateJan 30, 2018
Priority dateJan 30, 2018
Publication dateSep 21, 2021
Grant dateSep 21, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for providing an etch chamber part with a plasma resistant ceramic coating, comprising: placing a patterned mask on the etch chamber part, wherein the patterned mask comprises a layer of at least one of a powder coating, adhesive tapes, photosensitive resist, paint, silicones, or hardmasks; depositing a film over the etch chamber part, wherein the film is a molecular monolayer; removing the patterned mask after depositing the film; applying a plasma resistant ceramic coating on the etch chamber part after removing the patterned mask; and removing the film after applying the plasma resistant ceramic coating on the part. 2. The method, as recited in claim 1 , wherein the removing the film removes part of the plasma resistant ceramic coating that is applied over the film. 3. The method, as recited in claim 1 , wherein the film is a monolayer formed from a chemical precursor agent of at least one of a group comprising of hexamethyldisilazane (HMDS), alkoxysilanes and alkysilanes. 4. The method, as recited in claim 1 , further comprising removing one or more parts of the plasma resistant ceramic coating that is deposited over the film, comprising wiping or soaking the plasma resistant ceramic coating with at least one of isopropyl alcohol, PVA, alternative soft scrubbing or polish media, acetone, hydrogen fluoride/hydrogen peroxide solution, hydrogen fluoride solutions with glycerin, glycols or an ammonia containing solution or cleaning with detergents, ultrasonication or megasonication, water jet, CO 2 blasting or soft bead blasting. 5. The method, as recited in claim 1 , further comprising removing one or more parts of the plasma resistant ceramic coating that is deposited over the film, comprising directing solid CO 2 shavings towards the plasma resistant ceramic coating at a pressure greater than about 25 psi, wherein parts of the plasma ceramic coating that are not over the film are not removed. 6. The method, as recited in claim 1 , wherein the applying the plasma resistant ceramic coating comprises applying a thermal spray coating. 7. The method, as recited in claim 1 , further comprising cleaning the part after the removing the patterned mask and before applying the plasma resistant ceramic coating. 8. The method, as recited in claim 1 , wherein the plasma resistant ceramic coating comprises one or more of yttria, zirconia, or alumina. 9. The method, as recited in claim 1 , wherein the plasma resistant ceramic coating comprises one or more of a lanthanide series of a Group III or Group IV element. 10. The method, as recited in claim 1 , wherein the etch chamber part is at least one of a chamber liner, door, or pinnacle. 11. The method, as recited in claim 1 , wherein the applying the plasma resistant ceramic coating is after removing the patterned mask, and wherein the removing the patterned mask is after depositing the film, and wherein the depositing the film is after placing the patterned mask. 12. The method, as recited in claim 1 , further comprising using the part as a chamber liner, chamber door, or chamber pinnacle in an etch chamber.

Assignees

Inventors

Classifications

  • Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances · CPC title

  • After-treatment · CPC title

  • Aluminium oxide; Aluminium hydroxide; Aluminates · CPC title

  • Pretreatment of the material to be coated, e.g. for coating on selected surface areas · CPC title

  • characterised by the method of spraying · CPC title

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Frequently asked questions

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What does patent US11124659B2 cover?
A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
Who is the assignee on this patent?
Lam Res Corp
What technology area does this patent fall under?
Primary CPC classification C09D5/008. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 21 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).