Method for adhering resin molded articles

US11124602B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11124602-B2
Application numberUS-201113702885-A
CountryUS
Kind codeB2
Filing dateMay 31, 2011
Priority dateJun 10, 2010
Publication dateSep 21, 2021
Grant dateSep 21, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to the total dicarboxylic acid component is at least 13 mol % and no more than 35 mol %. It is preferable if the modified polyalkylene terephthalate resin is a modified polybutylene terephthalate resin, and the aromatic dicarboxylic acid and/or an ester compound thereof is isophthalic acid and/or an ester compound thereof.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for adhering a first modified polybutylene terephthalate resin molded article to a second resin molded article, comprising: (a) providing the modified polybutylene terephthalate resin, which is prepared by a method comprising: (i) copolymerizing an isophthalic acid and/or an ester compound thereof as a modified component with a polybutylene terephthalate resin, wherein the content of the modified component relative to the total dicarboxylic acid component is at least 15 mol % and no more than 30 mol % to produce a modified polybutylene terephthalate resin; and (ii) molding the modified polybutylene terephthalate resin into the first modified polybutylene terephthalate resin molded article and the second resin molded article; and (b) adhering the first modified polybutylene terephthalate resin molded article to the second resin molded article with an addition reaction-type silicone adhesive, wherein both the first modified polybutylene terephthalate resin molded article and the second resin molded article are made of the same modified polybutylene terephthalate resin, wherein the modified polybutylene terephthalate resin consists of the isophthalic acid-modified polybutylene terephthalate resin, and optionally one or more additives selected from the group consisting of nucleating agents, pigments, antioxidants, stabilizers, plasticizers, lubricants, mold-release agents, flame retardants and adhesiveness improvers, and wherein the isophthalic acid-modified polybutylene terephthalate resin is the only resin present in each of the first and second resin molded articles. 2. The method according to claim 1 , wherein the modified polybutylene terephthalate resin includes an adhesiveness improver selected from the group consisting of polysiloxanes having hydrogen atoms bonded to silicon atoms and trialkoxysilylalkyl groups, organic peroxides, and siloxanes or silanes having an acryloxyalkyl group, and polysiloxanes having an epoxy group and/or ester group bonded to a silicon atom and a hydrogen atom directly bonded to a silicon atom.

Assignees

Inventors

Classifications

  • C08G63/183Primary

    Terephthalic acids · CPC title

  • the acids or hydroxy compounds containing carbocyclic rings · CPC title

  • comprising polysiloxanes · CPC title

  • Flame-proofing or flame-retarding additives · CPC title

  • Adhesives without diluent · CPC title

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Frequently asked questions

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What does patent US11124602B2 cover?
To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to th…
Who is the assignee on this patent?
Sakata Kouichi, Polyplastics Co
What technology area does this patent fall under?
Primary CPC classification C08G63/183. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 21 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).