Integrated molded product

Patent metadata

Field	Value
Publication number	US-9249296-B2
Application number	US-201113823711-A
Country	US
Kind code	B2
Filing date	Aug 17, 2011
Priority date	Sep 17, 2010
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

To provide a technique in which a phosphorus compound does not inhibit curing of an addition reaction type silicone-based composition even though the addition reaction type silicone-based composition is in contact with a resin molded product containing the phosphorus compound. An integrated molded product including a thermoplastic resin molded product containing a phosphorus compound, an addition reaction type silicone-based composition, and a member, in which: the thermoplastic resin molded product is in contact with the addition reaction type silicone-based composition; and a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded product preferably contains a polybutylene terephthalate resin in light of heat resistance.

First claim

The invention claimed is:

1. An integrated molded product comprising a thermoplastic resin molded product, an addition reaction type silicone-based composition, and a member,
the thermoplastic resin molded product consisting of a polybutylene terephthalate-based resin and a pentavalent phosphorus compound, or consisting of a polybutylene terephthalate-based resin, a pentavalent phosphorus compound, and at least one component selected from the group consisting of an inorganic filler, an antioxidant, and a pigment,
the member being adhered to the thermoplastic resin molded product, and
the thermoplastic resin molded product being in contact with the addition reaction type silicone-based composition in any one of the following states (A) to (C):
(A) a state wherein the thermoplastic resin molded product and the member are bonded through the addition reaction type silicone-based composition;
(B) a state wherein the thermoplastic resin molded product is composed of a plurality of molded products and the plurality of molded products are bonded through the addition reaction type silicone-based composition; and
(C) a state wherein the addition reaction type silicone-based composition covers the surface of the member disposed on the thermoplastic resin molded product and is in contact with the thermoplastic resin molded product.

2. The integrated molded product according to claim 1 , wherein the pentavalent phosphorus compound is at least one selected from the group consisting of a phosphinate represented by the following formula (I), and a diphosphinate represented by the following formula (II):

wherein, R 1 , R 2 , R 3 and R 4 are each the same or different and represent an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group, and R 5 represents an alkylene group, an alicyclic bivalent group or an aromatic bivalent group; R 1 and R 2 may join with each other to form a ring together with adjacent phosphorus atoms; M m+ represents a metal having a valence of m, and m is an integer of 2 to 4; and M n+ represents a metal having a valence of n, and n is an integer of 2 to 4.

3. The integrated molded product according to claim 1 , wherein the pentavalent phosphorus compound is a phosphoric ester.

4. The integrated molded product according to claim 1 , wherein the pentavalent phosphorus compound is at least one selected from the group consisting of an alkali metal phosphate and an alkaline earth metal phosphate.

Assignees

• Sakata Kouichi
• Polyplastics Co

Inventors

• Sakata Kouichi

Classifications

• C08J5/128 Primary

  Adhesives without diluent · CPC title

• C08K5/5317

  Phosphonic compounds, e.g. R—P(:O)(OR')2 · CPC title

• C08L2201/02

  Flame or fire retardant/resistant · CPC title

• C08K5/005

  Stabilisers against oxidation, heat, light, ozone · CPC title

• B32B25/08

  of synthetic resin · CPC title