Method and system for charged particle microscopy with improved image beam stabilization and interrogation

Patent metadata

Field	Value
Publication number	US-11120969-B2
Application number	US-202016832973-A
Country	US
Kind code	B2
Filing date	Mar 27, 2020
Priority date	Mar 24, 2015
Publication date	Sep 14, 2021
Grant date	Sep 14, 2021

Abstract

A scanning electron microscopy system with improved image beam stability is disclosed. The system includes an electron beam source configured to generate an electron beam and a set of electron-optical elements to direct at least a portion of the electron beam onto a portion of the sample. The system includes an emittance analyzer assembly. The system includes a splitter element configured to direct at least a portion secondary electrons and/or backscattered electrons emitted by a surface of the sample to the emittance analyzer assembly. The emittance analyzer assembly is configured to image at least one of the secondary electrons and/or the backscattered electrons.

First claim

What is claimed:

1. A scanning electron microscopy apparatus for mitigating errors caused by surface charging comprising:
a primary electron beam source;
a set of electron-optical elements to direct at least a portion of the primary electron beam onto a surface of the sample;
an emittance analyzer assembly; and
a controller including one or more processors configured to execute a set of program instructions configured to cause the one or more processors to:
receive one or more surface potential measurements of the surface of the sample from the emittance analyzer assembly;
determine whether the surface of the sample is charged above a selected potential threshold based on the one or more surface potential measurements; and
upon determining the surface is charged above the selected threshold, direct at least one of the primary source or a flood source to provide a charge dose to the surface of the sample,

wherein the emittance analyzer assembly comprises:
a set of deflection optics;
a first electron-optic lens;
a first electron detector including a center aperture, wherein the first electron detector is configured to collect at least one of a portion of the secondary electrons or a portion of the backscattered electrons;
a first mesh element disposed downstream from the first electron detector;
a second mesh element disposed downstream from the first mesh element, wherein the first electron detector and the first mesh element form a deceleration region, wherein the first mesh element and the second mesh element form a drift region;
an energy filter disposed downstream from the second ground mesh element;
a second electron-optic lens; and
a second electron detector configured to collect at least one of an additional portion of the secondary electrons or an additional portion of the backscattered electrons.

2. The scanning electron microscopy apparatus of claim 1 , wherein the set of deflection optics is configured to align the image beam with one or more components of the emittance analyzer assembly.

3. The scanning electron microscopy apparatus of claim 1 , wherein the set of deflection optics include at least one of a set of electrostatic deflectors or magnetic deflectors.

4. The scanning electron microscopy apparatus of claim 1 , wherein the set of deflection optics are disposed within an acceleration liner.

5. The scanning electron microscopy apparatus of claim 1 , wherein the first electron-optic lens is disposed downstream from the set of deflection optics.

6. The scanning electron microscopy apparatus of claim 1 , wherein the first electron-optic lens comprises:
at least one of an electrostatic lens or a magnetic lens.

7. The scanning electron microscopy apparatus of claim 1 , wherein the first electron detector is held at ground.

8. The scanning electron microscopy apparatus of claim 1 , wherein the first mesh element is disposed downstream from the first electron detector and is held at a potential equal to the surface potential of the sample.

9. The scanning electron microscopy apparatus of claim 1 , wherein the second mesh element is disposed downstream from the first mesh element and is held at a potential equal to the surface potential of the sample.

10. The scanning electron microscopy apparatus of claim 1 , wherein the first mesh element comprises a planar wire mesh.

11. The scanning electron microscopy apparatus of claim 1 , wherein the second mesh element comprises a hemispherical wire mesh.

12. The scanning electron microscopy apparatus of claim 1 , wherein the energy filter comprises a hemispherical wire mesh.

13. The scanning electron microscopy apparatus of claim 1 , wherein at least one of the first electron detector or the second electron detector comprise:
at least one of a multi-channel plate detector, a solid state detector or a scintillator detector.

14. The scanning electron microscopy apparatus of claim 1 , wherein at least one of the first electron detector or the second electron detector are segmented into two or more segments.

15. The scanning electron microscopy apparatus of claim 1 , wherein the emittance analyzer assembly is configured to operate in secondary electron and backscattered electron imaging mode.

16. The scanning electron microscopy apparatus of claim 1 , wherein the emittance analyzer assembly is configured to operate in backscattered electron and high aspect ratio electron imaging mode.

17. The scanning electron microscopy apparatus of claim 1 , wherein the emittance analyzer assembly is configured to operate in backscattered electron only imaging mode.

18. The scanning electron microscopy apparatus of claim 1 , wherein the electron source is configured to apply an in-situ flood pre-dose to the sample via the flood source.

Assignees

• Kla Tencor Corp
• Kla Corp

Inventors

• Masnaghetti Doug K
• Toth Gabor
• Trease David
• Bothra Rohit
• Chen Grace Hsiu-Ling
• Knippelmeyer Rainer

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• H01J2237/057

  Energy or mass filtering · CPC title

• H01J2237/24475

  Scattered electron detectors · CPC title

• G01N23/203

  Measuring back scattering · CPC title

• H01J37/10

  Lenses · CPC title