Passive thermal diode for pipelines

Patent metadata

Field	Value
Publication number	US-11112190-B2
Application number	US-201916704973-A
Country	US
Kind code	B2
Filing date	Dec 5, 2019
Priority date	Dec 5, 2019
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A system and method for a passive thermal diode (PTD) to be disposed on a pipeline that inhibits heat transfer from the pipeline to the environment below a threshold temperature and promotes heat transfer from the environment to the pipeline above a threshold temperature.

First claim

What is claimed is:

1. A method of operating a passive thermal diode (PTD) disposed on a pipeline, comprising:
inhibiting, via the PTD, heat transfer from the pipeline to environment in response to an external temperature being below a threshold temperature; and
promoting, via the PTD, heat transfer from the environment to the pipeline in response to the external temperature being above the threshold temperature, wherein promoting the heat transfer comprises placing a heat-transfer material layer in contact with the pipeline via thermal expansion of a control material in the PTD, and wherein the heat transfer from the environment to the pipeline comprises heat transfer from the environment through the heat-transfer material layer to the pipeline.

2. The method of claim 1 , wherein the external temperature comprises an external surface temperature of the PTD, and wherein heat transfer from the environment to the pipeline increases temperature of a fluid transported in the pipeline.

3. The method of claim 1 , wherein the external temperature comprises a temperature of an external graphene sheet of the PTD, and wherein heat transfer from the environment to the pipeline decreases viscosity of a fluid transported in the pipeline.

4. The method of claim 1 , wherein the threshold temperature comprises a deformation temperature of a phase change material (PCM) in the PTD, and wherein electricity is not supplied to the PTD.

5. The method of claim 1 , wherein the heat-transfer material layer comprises a graphene sheet.

6. The method of claim 1 , wherein the control material comprises a phase change material (PCM).

7. The method of claim 6 , wherein the threshold temperature comprises a deformation temperature of the PCM, and wherein the PCM comprises a PCM bag.

8. The method of claim 1 , wherein the PTD comprises a polymer layer comprising two sections, wherein the control material resides between the two sections, and wherein the heat-transfer material layer is placed in contact with the pipeline via compression exerted by the two sections on the control material via thermal expansion of the two sections.

9. The method of claim 1 , wherein the heat-transfer material layer comprises a graphene sheet thermally coupled to an external graphene sheet, and wherein the heat transfer from the environment to the pipeline comprises heat transfer from the external graphene sheet to the graphene sheet.

10. The method of claim 1 , wherein the inhibiting the heat transfer comprises inhibiting the heat transfer from the pipeline to the environment via an insulation material layer in an upper portion of the PTD.

11. The method of claim 1 , wherein the inhibiting the heat transfer comprises inhibiting the heat transfer from the pipeline to the environment via an air gap in a lower portion of the PTD.

12. A method of operating a passive thermal diode (PTD) disposed on a pipeline, comprising:
inhibiting heat transfer from the pipeline to environment via an insulation material layer in an upper portion of the PTD and via a gap in a lower portion of the PTD; and
placing a heat-transfer material layer of the PTD in contact with the pipeline to provide for heat transfer from the environment through the heat-transfer material layer to the pipeline, wherein the heat-transfer material layer is placed in contact with the pipeline via thermal expansion of a control material in the PTD.

13. The method of claim 12 , wherein the control material comprises a phase change material (PCM), and wherein power is not supplied to the PTD.

14. The method of claim 12 , wherein the heat-transfer material layer comprises a graphene sheet, and wherein the pipeline comprises a steel pipeline.

15. The method of claim 14 , wherein the graphene sheet is thermally coupled to an external graphene sheet, and wherein the heat transfer from the environment to the pipeline comprises heat transfer from the external graphene sheet through the graphene sheet to the pipeline.

16. The method of claim 12 , wherein the insulation material layer is adjacent the pipeline, and wherein the gap is adjacent the pipeline.

17. The method of claim 16 , wherein placing the heat-transfer material layer in contact with the pipeline comprises moving the heat-transfer material layer within the gap to contact the pipeline, and wherein the heat transfer through the heat-transfer material layer bypasses the insulation material layer.

18. The method of claim 12 , wherein inhibiting heat transfer is in response to an external temperature being less than a threshold temperature, and wherein placing a heat-transfer material layer of the PTD in contact with the pipeline to provide for heat transfer from the environment through the heat-transfer material layer to the pipeline is in response to the external temperature exceeding the threshold temperature.

19. The method of claim 18 , wherein the external temperature comprises an external surface temperature of the PTD or a temperature of an external graphene sheet of the PTD, or a combination thereof.

Assignees

• Saudi Arabian Oil Co

Inventors

• Villette Thibault Tarik
• Raynel Guillaume Robert Jean-Francois

Classifications

• F24S2080/07

  Arrangements for one-way heat transfer, e.g. thermal diodes · CPC title

• F28F13/00 Primary

  Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title

• F16L59/029

  layered · CPC title

• F28F27/00

  Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus (control arrangements in general G05) · CPC title

• F25D19/006

  Thermal coupling structure or interface · CPC title